Cylindrical Electrode Resin Sealing Method
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Solution Overview
Problem
Existing methods for manufacturing semiconductor devices with cylindrical electrodes often result in excessive parts and potential damage to joints due to resin sealing, as they require unnecessary components and can damage the solder joint under pressure.
Innovation Solution
A method where the semiconductor chip and cylindrical electrode are sealed with resin, and then an opening is formed at the end of the cylindrical electrode after sealing, preventing resin entry without increasing parts and minimizing joint damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cap jig or sleeve is used to close the cylindrical electrode during resin sealing, then resin entry into the cylindrical electrode is suppressed, but the number of parts increases excessively and manufacturing cost rises
Solution Approach 1:
The cylindrical electrode itself is designed to be deformable under resin injection pressure, allowing it to automatically close its opening and prevent resin entry without requiring external cap jigs or sleeves. The electrode's own structural properties are utilized to achieve the protective function.
Solution Approach 2:
The cylindrical electrode is designed with specific material properties and geometric parameters (thickness, diameter ratios, deformation characteristics) that enable it to deform elastically under pressure during resin injection, dynamically closing the opening to prevent resin entry.
2Reliability
If the metal mold directly presses the cylindrical electrode during sealing, then resin entry is suppressed, but the solder joint may be damaged due to excessive pressure
Solution Approach 1:
The deformable cylindrical electrode acts as a cushioning element between the metal mold and the solder joint. During resin injection, the electrode deforms to absorb excess pressure, preventing direct transmission of high forces to the fragile solder joint while still effectively blocking resin entry.
Solution Approach 2:
The cylindrical electrode serves as an intermediary component between the metal mold's pressing force and the solder joint. It mediates the pressure transmission, allowing sufficient force to close the opening and prevent resin entry while protecting the solder joint from damaging stresses.
3Reliability
If the cylindrical electrode has a spring characteristic with different outer periphery sizes, then it can suppress resin entry, but it increases device complexity and manufacturing difficulty
Solution Approach 1:
The cylindrical electrode is designed with optimized geometric parameters (uniform or gradually varying thickness, specific diameter ratios) that provide the necessary deformability for closing the opening during resin injection. These parameter optimizations enable effective resin suppression while maintaining manufacturing simplicity through standardized production processes.
Data Source
AI summary
Entry of resin into a cylindrical electrode can be suppressed without excessively increasing the number of parts and without unnecessarily damaging members. For this purpose, a semiconductor chip and a cylindrical electrode are mounted on one main surface of substrate. The substrate, the semiconductor chip, and the cylindrical electrode are sealed with resin material such that the cylindrical electrode has one end mounted to the substrate and the other opposite end at least exposed. After the step of sealing, an opening extending from the other end of the cylindrical electrode to a cavity in the cylindrical electrode is formed. Before performing the step of forming an opening, the other end of the cylindrical electrode is closed.