Cylindrical Gas Ejection Nozzle Layout for Uniform Wafer Processing
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Solution Overview
Problem
In vertical type substrate processing apparatuses, the process gas flow path area is reduced, making it difficult to control the gas flow inside the process vessel effectively.
Innovation Solution
An ejection apparatus with cylindrical nozzles is positioned beside the substrate, featuring ejection holes that direct gas flow both parallel and inclined to the substrate surface, enhancing gas distribution and flow path area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If process gas is supplied toward the center of each wafer using a conventional nozzle, then the nozzle structure is simple, but the flow path area of the process gas is reduced and gas flow control becomes difficult
Solution Approach 1:
The patent transitions from a single-dimension gas supply approach (center-directed) to a multi-dimensional approach by arranging ejection holes in multiple directions (vertical, inclined, and horizontal surfaces) of the cylindrical nozzle, thereby expanding the flow path area and improving gas distribution
Solution Approach 2:
The nozzle is segmented into multiple ejection surfaces (vertical, inclined, and horizontal) with ejection holes distributed across different directions, allowing the gas flow to be divided into multiple pathways that collectively increase the total flow path area
2Device complexity
If process gas is supplied toward the center of each wafer, then the nozzle configuration is simple, but the uniformity of gas distribution across the substrate surface deteriorates
Solution Approach 1:
Different surfaces of the cylindrical nozzle are equipped with ejection holes oriented in different directions (vertical, inclined, horizontal) to create locally optimized gas distribution patterns that collectively achieve uniform coverage across the entire substrate surface
Solution Approach 2:
The cylindrical nozzle features asymmetric ejection hole arrangements on different surfaces (with inclined surfaces at specific angles), breaking the symmetry of conventional center-directed nozzles to achieve more uniform gas distribution across the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves gas flow control and distribution, ensuring uniform processing across the substrate surface.
Implementation Method 1
configured to eject the gas substantially in a same direction; and a second ejection hole arranged on at least one of the two surfaces and configured to eject the gas in a direction inclined with respect to the same direction
Data Source
AI summary
It is possible to increase a flow path area of a process gas. There is provided a technique that includes: an ejection apparatus beside a substrate, extending along a direction perpendicular to the substrate, and configured to eject a gas onto the substrate, wherein the ejection apparatus includes: a first nozzle and a second nozzle, and wherein each of the first nozzle and the second nozzle is provided with: a flat surface facing the substrate; two surfaces connected to both sides of the flat surface; a plurality of first ejection holes arranged on the flat surface along a direction parallel to the substrate and configured to eject the gas substantially in a same direction; and a second ejection hole arranged on at least one of the two surfaces and configured to eject the gas in a direction inclined with respect to the same direction.