Cylindrical Photosensitive Element Thermal Bonding Process

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current methods for forming cylindrically-shaped photosensitive elements for printing forms are time-consuming and require the use of adhesive materials, which can introduce defects and increase complexity, such as bubbles and non-uniformities, affecting the printing process.

Innovation Solution

A process that preheats a cylindrically-shaped support and/or photosensitive layer to facilitate direct attachment and sealing without adhesives, using a thermoplastic binder and photoinitiator, allowing for quick formation of a continuous, seamless layer on the support.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If adhesive materials are used to join the photosensitive layer to the support, then the attachment strength is improved, but the manufacturing complexity and defect risk increase

Engineering Contradiction:
Improveattachment strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent removes the adhesive layer from the manufacturing process entirely. Instead of applying adhesive and then bonding, the invention uses direct thermal bonding where the support surface is heated to melt the thermoplastic binder in the photosensitive layer, eliminating the adhesive material step and associated defects like bubbles and non-uniformity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding mechanism of adhesives with a thermal bonding mechanism. By heating the support surface to a temperature that melts the thermoplastic binder, the photosensitive layer bonds directly to the support through熔融 bonding, substituting the adhesive chemical bond with a thermal-mechanical bond.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If adhesive materials are applied to the support surface, then the bonding reliability is improved, but the production time increases

Engineering Contradiction:
Improvebonding reliabilityVSAvoidproduction time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent performs preliminary heating of the support surface before applying the photosensitive layer. By pre-heating the support to the bonding temperature, the thermoplastic binder is already in a molten state ready for immediate bonding, eliminating the time required for adhesive drying or curing and enabling faster production.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the temperature parameter of the support surface to enable direct bonding. By maintaining the support at a temperature above the melting point of the thermoplastic binder, the material transitions from a bonded state to a molten state that can be directly bonded to the support without adhesive, reducing production time while maintaining reliability.

Inventive Principle:
Principle #35Parameter changes

3Strength

If adhesive materials are used, then the layer attachment is improved, but the printing quality deteriorates due to defects

Engineering Contradiction:
Improvelayer attachmentVSAvoidprinting quality
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent extracts and removes the adhesive layer from the structure entirely. By using direct thermal bonding, there is no adhesive layer to contain bubbles, run, or become non-uniform, thereby eliminating these defects that would compromise printing quality while maintaining layer attachment through熔融 bonding.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent converts the potential harm of the thermoplastic binder (which could create defects like bubbles and non-uniformity) into a benefit by using its melting properties for direct bonding. The same thermoplastic binder that could cause defects is instead used to create a defect-free bond by melting and fusing directly to the heated support surface.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method significantly reduces production time, eliminates the need for adhesive materials, and ensures a seamless, defect-free photosensitive element suitable for relief and gravure printing, enhancing printing quality and efficiency.

Implementation Method 1

The layer is preheated to a temperature less than its glass transition temperature or the exterior surface of the support is preheated to a temperature greater than 39°C prior to contacting the layer to the support

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 2

contacting the contact surface of the photosensitive layer to the exterior surface of the support by wrapping the photosensitive layer around the support

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2026132B1Process for making a cylindrically-shaped photosensitive element for use as a printing form
Publication Date: 2013.03.13 EI DU PONT DE NEMOURS & CO
  • EP2026132B1 patent drawingFigure 1~3

AI summary

The invention relates to a process for making a cylindrically-shaped photosensitive element for use as a printing form. The process includes a step of preheating a photosensitive layer and/or a cylindrically shaped support prior to contacting of the photosensitive layer to the support. The photosensitive layer is laminated to seal and fuse adjacent ends together forming the cylindrical photosensitive element.