Cylindrical Polishing Wheel with Z-Axis Motion for Substrate Edge and Surface Finishing
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Solution Overview
Problem
Existing substrate polishing systems face challenges in uniformly polishing the upper, side, and lower surfaces of substrates due to non-uniform contact and pressure distribution, leading to varying polishing quality and increased slurry consumption, and are unable to simultaneously process side surfaces and edges.
Innovation Solution
A substrate polishing system with a cylindrical polishing wheel having a rotating shaft mounted perpendicularly to the substrate, equipped with Z-axis movement for vertical motion and an elastic surface layer made of polyurethane and cerium oxide, allowing simultaneous polishing of all surfaces while ensuring uniform wear and efficient slurry distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are stacked and polished together using a rotating brush, then polishing efficiency is improved, but polishing quality becomes non-uniform due to varying contact pressure and distance between substrates and brush
Solution Approach 1:
The invention divides the polishing wheel into multiple independent polishing units, each capable of independently contacting and polishing a substrate. This segmentation allows each polishing unit to maintain consistent contact pressure with its corresponding substrate, eliminating the pressure variation problem that occurs when stacking multiple substrates under a single rotating brush.
Solution Approach 2:
The invention uses multiple polishing units that can contact substrates at different positions and angles, ensuring that each substrate receives adequate polishing pressure. By providing more polishing contact points than traditionally used, the system maintains uniform pressure distribution across all substrates while improving overall polishing efficiency.
2Manufacturing precision
If contact points between substrates and brush vary in direction and angle, then polishing quality becomes non-uniform, but providing separate slurry injection holes for each position increases slurry consumption
Solution Approach 1:
The invention designs a universal slurry supply system where a single slurry injection hole serves multiple polishing units. The slurry is distributed through a common supply line that reaches all polishing positions, eliminating the need for separate injection holes at each contact point. This reduces slurry consumption while maintaining uniform polishing quality across all substrates.
3Productivity
If substrates are stacked for polishing, then processing efficiency is improved, but side surfaces and edges cannot be processed simultaneously
Solution Approach 1:
The invention transitions from a traditional horizontal brush polishing approach to a vertical cylindrical polishing wheel configuration. This dimensional change allows the polishing wheel to contact substrates from the side, enabling simultaneous polishing of side surfaces, edges, and upper surfaces. The cylindrical shape of the polishing wheel provides multi-directional contact capability that accommodates various substrate orientations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves uniform polishing of all substrate surfaces, extending the lifespan of the polishing wheel and improving polishing quality by ensuring consistent contact and pressure distribution, reducing slurry consumption, and enabling efficient processing of both sides and edges.
Implementation Method 1
the substrates are polished through the friction caused by brush hair 110 by the rotation of the brush 100
Implementation Method 2
the substrates are polished through the friction caused by brush hair 110 by the rotation of the brush 100
Data Source
AI summary
Provided are a device and method for polishing a substrate, in which an upper ground surface, a side surface and a lower ground surface of a substrate can be simultaneously polished, and a polishing wheel can be evenly used on the whole so as to be uniformly abraded. A substrate polishing system is to polish a substrate, of which upper edge and a lower edge are polished, and includes: a table, on which the substrate is secured; a spindle provided at the upper portion of a side surface of the table; a polishing wheel formed in the shape of a cylinder and having a rotating shaft mounted perpendicularly to the substrate, so as to polish the substrate with a side surface thereof while rotating by the spindle; and a Z axis movement means for moving the polishing wheel in the vertical direction during the polishing of the substrate.