Cylindrical Semiconductor Module Arrangement for Low Inductance
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Solution Overview
Problem
Existing semiconductor modules with trapezoidal shapes face challenges in reducing size and wire inductance due to longer wire lengths between electrodes and external apparatuses.
Innovation Solution
The semiconductor module design incorporates tapers on side surfaces and secure fastening portions on electrodes, allowing for shorter wire paths and efficient linking of modules, reducing the size and inductance of the power conversion apparatus by arranging modules in a cylindrical configuration with alternating electrode placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor modules are arranged in a ring with trapezoidal shape, then the modules can be connected to form a compact structure, but the wire length between main electrodes and external apparatus increases, leading to increased inductance
Solution Approach 1:
The patent transitions from planar ring arrangement to three-dimensional cylindrical arrangement, where semiconductor modules are positioned vertically along the circumference. This spatial reconfiguration allows main electrodes to extend radially outward, significantly shortening wire paths to external apparatus while preserving the compact ring structure.
Solution Approach 2:
The patent employs a cylindrical configuration where semiconductor modules are arranged along the circumferential direction. This curved geometry enables radial electrode extension, optimizing the distance from internal electrodes to external connection points while maintaining structural compactness.
2Loss of energy
If main electrodes are positioned on the cylindrical surface, then wire inductance is reduced, but the structural complexity of the semiconductor module increases
Solution Approach 1:
The cylindrical body structure serves multiple functions simultaneously: it provides mechanical support for module arrangement, defines the radial positioning of main electrodes, and enables the compact ring configuration. This multi-functionality reduces the need for additional structural components.
Solution Approach 2:
The patent integrates the main electrodes directly into the cylindrical body structure, merging the electrode function with the structural housing. This consolidation eliminates separate electrode mounting structures and simplifies the overall module design while achieving low inductance.
Data Source
AI summary
A semiconductor module includes a base plate for dissipating heat and a body having a bottom surface facing the base plate, a top surface opposite the bottom surface, and side surfaces between the bottom and top surfaces, wherein a first main electrode through which a first main current flows faces a first side surface among the side surfaces, and a second main electrode through which a second main current flows faces a second side surface opposite the first side surface. A power conversion apparatus includes a plurality of the semiconductor modules, wherein a cylindrical section is formed by arranging the semiconductor modules to surround a predetermined position, some of the first and second main electrodes are arranged on a first ring-shaped end surface at one end of the cylindrical section, and remaining electrodes are arranged on a second ring-shaped end surface at another end of the cylindrical section.