Cylindrical Thermoelectric Module With Interrupted Inner Surface
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Solution Overview
Problem
Existing thermoelectric modules for vehicle generators face challenges in manufacturing complexity, tolerance requirements, and efficiency due to the need for precise component matching and compensation for thermal expansion, which complicates the assembly and reduces the module's stability and heat transfer efficiency.
Innovation Solution
A thermoelectric module design featuring a cylindrical configuration with an inner and outer frame part that forms an interrupted circumferential surface, allowing for a larger heat transfer area, and utilizing a dimensionally unstable sheath to prevent material diffusion and thermal stress, while simplifying assembly and reducing the number of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large number of individual components (thermoelectric material, diffusion barrier, electrically conducting bridges, insulation) are assembled to form thermoelectric modules, then the functional performance and reliability are improved, but the manufacturing complexity and tolerance requirements increase significantly
Solution Approach 1:
The patent combines multiple individual components (thermoelectric material, diffusion barrier, electrically conducting bridges, and insulation) into an integrated semiconductor element structure. This merging reduces the number of separate assembly steps and tolerance matching requirements while maintaining the functional performance of each component.
Solution Approach 2:
The semiconductor elements are designed to serve multiple functions simultaneously: they provide thermoelectric conversion, act as structural support, and integrate electrical connections. This multi-functionality reduces the overall component count and simplifies the module construction.
2Reliability
If precise matching of component tolerances is required during assembly, then the functional performance is improved, but the manufacturing precision requirements and production time increase
Solution Approach 1:
By integrating the diffusion barrier, thermoelectric material, and electrically conducting bridges into a single semiconductor element, the patent eliminates the need for precise tolerance matching between these separate components during assembly, thereby reducing manufacturing precision requirements.
3Stability of the object's composition
If housing and supporting structures are added to secure semiconductor elements, then the structural stability is improved, but the weight and device complexity increase
Solution Approach 1:
The patent integrates the housing and supporting structures into the semiconductor element design itself, where the element's own structure provides both mechanical support and functional capabilities, thereby reducing the need for separate housing components.
4Reliability
If diffusion barriers are added between electrically conducting bridges and thermoelectric material, then the reliability is improved, but the device complexity and manufacturing steps increase
Solution Approach 1:
The diffusion barrier is integrated directly into the semiconductor element structure rather than being added as a separate component between the electrically conducting bridges and thermoelectric material, thereby maintaining reliability while reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the efficiency of electric energy production from exhaust gas thermal energy by increasing the heat transfer area, simplifying manufacturing, and maintaining structural stability under thermal stress without additional material stress, thus improving energy efficiency and reducing production complexity.
Implementation Method 1
Thermoelectric materials can convert thermal energy into electric energy (Seebeck effect)
Implementation Method 2
Thermoelectric materials can convert thermal energy into electric energy (Seebeck effect) and vice versa (Peltier effect)
Implementation Method 3
due to the different thermal stresses on the outer and inner housing parts, there is also a need to compensate for different expansion behavior by the components without introducing particularly high stresses into the thermoelectric material
Data Source
AI summary
A thermoelectric module includes an interrupted inner circumferential surface, an axis and an outer circumferential surface. A plurality of semiconductor elements having thermoelectric material are disposed in direction of the axis and between the inner circumferential surface and the outer circumferential surface and are electrically alternately connected to each other. At least some of the semiconductor elements include at least one inner frame part or an outer frame part and at least the inner frame parts form the interrupted inner circumferential surface. The inner circumferential surface also forms a cold side of the thermoelectric module and a dimensionally unstable sheath is provided at least at the interrupted inner circumferential surface. A vehicle having a plurality of thermoelectric modules is also provided.