Cylindrical Vacuum Envelope for Uniform Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current high volume production systems for material deposition in applications like photovoltaic cells and semiconductor processing face challenges in achieving uniform deposition on multiple substrates while minimizing material waste and reducing equipment costs.
Innovation Solution
A high throughput deposition apparatus featuring a cylindrical vacuum envelope with deposition sources conforming to its shape, allowing for increased substrate processing capacity, improved uniformity, and reduced material waste through a closed loop substrate carrier system and optimized deposition source configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional planar or rotary deposition sources are used in box-shaped chambers, then the system is easier to manufacture and operate, but the deposition uniformity across multiple substrates deteriorates and material waste increases
Solution Approach 1:
The patent applies spherical geometry by positioning multiple planar deposition sources on the surface of a sphere, with substrates arranged concentrically. This spherical configuration ensures that deposition materials reach all substrates uniformly from equidistant sources, resolving the deposition uniformity issue while maintaining manageable system complexity through modular source placement.
Solution Approach 2:
The patent transitions from conventional 2D planar source arrays to a 3D spherical arrangement of deposition sources. This dimensional change allows materials to be deposited from multiple angles and positions simultaneously, achieving uniform coverage across multiple substrates while optimizing space utilization within the chamber.
2Productivity
If box-shaped vacuum chambers are used with flat deposition sources, then the equipment is cheaper and easier to manufacture, but the number of substrates that can be processed simultaneously is limited
Solution Approach 1:
The patent employs a cylindrical vacuum chamber with a spherical arrangement of deposition sources positioned at the center. This geometric configuration maximizes the number of substrates that can be accommodated in a concentric arrangement around the sources, increasing processing capacity while the modular spherical source design keeps manufacturing complexity manageable.
Solution Approach 2:
The patent implements a nested configuration where multiple substrates are arranged in concentric circles around the central spherical deposition sources. This nesting approach allows maximum substrate density within the cylindrical chamber volume, enabling simultaneous processing of numerous substrates without requiring an excessively large chamber.
3Duration of action of moving object
If conventional deposition sources with high material usage rates (20-50%) are used, then the deposition speed is maintained, but the operational uptime decreases due to frequent material replacement
Solution Approach 1:
The patent combines multiple planar deposition sources into a unified spherical source array, where each source contributes to the overall deposition process. This merging of multiple sources provides redundancy and continuity, ensuring that if one source material is depleted, others can continue operating, thereby extending operational uptime while maintaining overall deposition throughput.
Solution Approach 2:
The patent implements a system where deposition source materials can be independently monitored and replaced. When one source material is depleted, it can be replaced or recovered while other sources continue operating, minimizing downtime and maintaining productivity through partial system continuity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enhances deposition uniformity, increases substrate processing capacity, reduces material waste, and lowers equipment costs by utilizing a cylindrical design and closed loop substrate carriers, thereby improving operational uptime and reducing the need for frequent material replacements.
Implementation Method 1
a cylindrical vacuum envelope can be used because it can stand higher pressure difference than a box envelope, and thus requires thinner walls to hold vacuum pressure
Implementation Method 2
Material deposition in vacuum is widely used in photovoltaic cells and panels, window glass coating, flat panel display manufacturing
Data Source
AI summary
A high throughput deposition apparatus includes a first process chamber; one or more first deposition sources in the first process chamber; a first main carrier comprising a plurality of first sub-carriers each configured to carry one or more substrate each positioned around an axial direction and configured to receive a first deposition material from the one or more first deposition sources, wherein the first sub-carriers define a curved surface around the axial direction; and a transport mechanism configured to move the first main carrier along the axial direction through the first process chamber.