D-Ring Lead Frame for IC Packaging Adhesion
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Solution Overview
Problem
Integrated circuit packages face challenges with silver adhesion issues to encapsulation materials, leading to potential separation between the integrated circuit die and the die pad, which affects manufacturing costs, yields, and package dimensions.
Innovation Solution
The implementation of a D-ring structure with a paddle, ring, and tie bars, where the integrated circuit die is mounted on the central portion of the D-ring, and encapsulated along with a portion of the D-ring, providing additional ground connections and stress relief, while minimizing surface contact and adhesion issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ground ring coated with silver is used to improve bonding adhesion, then bonding adhesion between wires and ground ring is improved, but adhesion between encapsulation material and ground ring deteriorates causing separation
Solution Approach 1:
The patent removes the silver coating from the ground ring structure, extracting the problematic element that caused weak adhesion with encapsulation material. The ground ring is formed without silver plating, eliminating the source of the adhesion failure while maintaining the structural ground connection function.
Solution Approach 2:
The patent uses a simple metal ground ring structure without expensive silver coating, replacing the costly silver-plated ground ring with a basic metal structure that achieves the same functional purpose without the adhesion problems.
2Reliability
If traditional lead frame structures with separate ground ring are used, then ground connections are facilitated, but package dimensions increase and manufacturing complexity increases
Solution Approach 1:
The patent merges the ground ring structure with the lead frame body, creating an integrated structure where the ground ring is formed as part of the lead frame rather than as a separate component. This integration reduces overall package dimensions while maintaining ground connection functionality.
Solution Approach 2:
The lead frame structure is designed to serve multiple functions simultaneously - providing mechanical support, electrical connections, and ground references through the integrated ground ring, eliminating the need for separate dedicated ground ring components.
3Reliability
If traditional packaging materials and processes are used, then comprehensive protection is provided, but manufacturing costs increase and yields decrease
Solution Approach 1:
The patent removes unnecessary packaging materials and process steps, extracting only the essential protection needed while eliminating redundant elements that increase cost and complexity. The simplified structure requires fewer packaging layers and less complex assembly processes.
Solution Approach 2:
The patent changes the structural parameters of the lead frame and package design to reduce the need for additional protective materials, optimizing the balance between protection and manufacturing efficiency.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system is provided including: forming a D-ring includes half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.