Programmable D2D Link Test Patterns for Aging Path Defects

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Solution Overview

Problem

Existing semiconductor devices with die-to-die communication links face challenges in effectively testing transmission paths due to the inability to adapt test patterns and conditions to different defect types and aging components, which are not addressed by traditional fixed pattern generators.

Innovation Solution

Implementing programmable test circuits and methods that allow for flexible test patterns and conditions to be applied to die-to-die paths, using programmable test pattern circuits and control circuits to compare expected patterns with received data, enabling adaptive testing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If fixed pattern generators are used in traditional test circuits, then the circuit structure is simple and manufacturing is easy, but the testing cannot adapt to different defect types and aging components

Engineering Contradiction:
Improvetesting adaptabilityVSAvoidcircuit complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent implements dynamic test patterns that can change over time and be programmed differently, allowing the same test circuit to adapt to various defect types and aging stages without requiring multiple fixed circuits. The test patterns transition from static to dynamic, enabling flexibility while maintaining circuit simplicity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the parameters of test patterns (such as pattern type, frequency, and sequence) to match different defect characteristics and aging conditions. By programmatically adjusting these parameters, the system achieves high adaptability without increasing fundamental circuit complexity.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If multiple fixed test circuits are implemented for different defect types, then testing coverage is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improvetesting effectivenessVSAvoidmanufacturing simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent creates a universal test circuit that can perform multiple testing functions by programming different test patterns. This single multi-functional circuit replaces what would otherwise require multiple specialized fixed circuits, maintaining comprehensive testing coverage while simplifying manufacturing.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

By implementing dynamic, programmable test patterns in a single circuit, the system achieves comprehensive defect coverage without manufacturing multiple fixed circuits. The dynamic nature allows one circuit to fulfill the roles of many specialized circuits.

Inventive Principle:
Principle #15Dynamics

3Measurement precision

If traditional fixed pattern testing is used, then the test circuit is simple to operate, but it cannot effectively test aging components or different defect types

Engineering Contradiction:
Improvedefect detection precisionVSAvoidoperation simplicity
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The test system automatically selects and applies appropriate test patterns based on the testing requirements, reducing the need for manual intervention. The programmable nature allows the system to self-adapt to different testing scenarios while maintaining ease of operation through automated pattern selection and application.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The system automatically adjusts test pattern parameters to match the specific testing needs, whether for new components or aging devices. This automated parameter adjustment maintains operational simplicity while achieving high measurement precision for defect detection.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentEP4664124A1Flexible pattern testing for d2d link paths
Publication Date: 2025.12.17 INTEL CORP
  • EP4664124A1 patent drawingFigure 1~2
  • EP4664124A1 patent drawingFigure 3
  • EP4664124A1 patent drawingFigure 4

AI summary

In some embodiments, circuitry for implementing programmable die-to-die path test patterns is provided. A D2D link may include latches for transmitting data through a path between first and second dies and also may include transmit and receive test control circuits for programming desired patterns to be driven through the path in order to test it.