Die-to-Die Interface Bump Layout for West-East Multi-Trace Routing
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Solution Overview
Problem
Current Die-to-Die package interfaces, such as those using interposers or redistribution layers, are limited in their ability to support high-speed West-East interconnections due to the stagger bump assignment, which only allows for one trace in the West-East orientation, restricting signal integrity and efficiency.
Innovation Solution
A communication interface structure is designed with a first row-column configuration of bumps and a second row-column configuration of secondary bumps, where the secondary bumps are positioned to create additional space for conductive lines, allowing for multiple traces in the West-East orientation by redistributing the bump positions and using conductive lines to connect them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If stagger bump assignment is used in the interface, then beachfront efficiency is improved, but only one trace can be afforded on each interface in W-E orientation
Solution Approach 1:
The patent applies asymmetry by using different bump configurations for different orientations: in-line bump map for W-E orientation and stagger bump map for N-S orientation. This asymmetric approach allows the interface to optimize for each direction independently, enabling multiple traces in W-E orientation while maintaining beachfront efficiency through stagger bump assignment.
Solution Approach 2:
The patent implements dynamics by making the bump map configuration adaptable to the interconnection orientation. The system dynamically selects between in-line and stagger bump maps based on whether the interconnection is W-E or N-S oriented, allowing the interface structure to optimize its trace capacity and beachfront efficiency according to the specific routing requirements.
2Adaptability or versatility
If in-line bump map is used, then multiple traces can be afforded in W-E orientation, but beachfront efficiency is reduced compared to stagger bump map
Solution Approach 1:
The patent segments the bump map configuration into two distinct types: in-line bump map for W-E oriented interconnections and stagger bump map for N-S oriented interconnections. This segmentation allows each orientation to use the most appropriate bump configuration, enabling multiple traces in W-E orientation while preserving beachfront efficiency through stagger bump assignment for N-S orientation.
Solution Approach 2:
The patent creates a universal interface structure that can accommodate both in-line and stagger bump map configurations depending on the interconnection orientation. This multi-functional approach allows the same interface to support multiple traces in W-E orientation when needed while maintaining optimal beachfront efficiency when N-S orientation is used, making the interface adaptable to different routing scenarios.
3Speed
If interface is designed for one direction (N-S orientation), then high speed interconnection is supported, but West-East interconnection is restricted
Solution Approach 1:
The patent implements dynamics by making the bump map configuration adaptable to the interconnection orientation. The system dynamically selects between in-line and stagger bump maps based on whether the interconnection is W-E or N-S oriented, allowing the interface structure to optimize its trace capacity and beachfront efficiency according to the specific routing requirements, thereby supporting high-speed interconnection in both directions.
Solution Approach 2:
The patent applies parameter changes by modifying the bump map configuration parameter based on the interconnection orientation. When W-E orientation is required, the system changes to in-line bump map configuration to enable multiple traces; when N-S orientation is used, it maintains stagger bump map configuration for optimal beachfront efficiency, thus supporting high-speed interconnection adaptably in both orientations.
Data Source
AI summary
A communication interface structure and a Die-to-Die package are provided. The communication interface structure includes first bumps arranged in a first row-column configuration, second bumps arranged in a second row-column configuration, and conductive lines disposed between the first bumps and the second bumps to connect each of the first bumps to each of the second bumps. The first bumps in neighboring rows are alternately shifted with each other. The second bumps are disposed under or over the first bumps, wherein each of the second bumps in even rows is at a position shifted in a column direction from a center of each of the first bumps in the even rows, and each of the second bumps in odd rows is at a position between two of the second bumps in the even rows in the column direction.