Die-to-Die Interconnect Parameter Exchange for UCIe Link Negotiation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing interconnect architectures in computing systems face challenges in efficiently handling high-performance computing demands, particularly in server environments, where communication between multiple processors and devices is critical, and current solutions lack interoperability and scalability across different vendors and technology nodes.
Innovation Solution
The introduction of the Universal Chiplet Interconnect Express (UCIe) protocol provides a standardized, high-bandwidth, low-latency, and power-efficient die-to-die interconnect that supports multiple protocols, enabling seamless interoperability and flexible integration of chiplets from different vendors and technology nodes, facilitating on-package and off-package connectivity across various computing segments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional multi-drop buses are used for interconnect, then electrical communication is simplified, but communication speed and bandwidth are limited
Solution Approach 1:
The patent segments the interconnect architecture into multiple independent point-to-point links instead of using a shared multi-drop bus. Each link operates independently at higher speeds, allowing parallel communication between processor sockets and other devices, thereby increasing overall communication bandwidth and speed while maintaining manageable complexity through modular design
Solution Approach 2:
The patent transitions from a single-dimensional shared bus architecture to a multi-dimensional mesh-like interconnect fabric with multiple routing paths. This dimensional expansion allows data to travel through multiple parallel channels simultaneously, dramatically increasing communication speed and bandwidth while distributing the complexity across multiple simpler link layers
2Productivity
If multiple physical processors are added to increase computing power, then processing capability is improved, but communication between sockets becomes more critical and complex
Solution Approach 1:
The patent implements a universal interconnect protocol that can handle multiple types of communication transactions (memory access, I/O operations, processor-to-processor communication) through a single standardized interface. This universal protocol simplifies the communication infrastructure needed to support multiple physical processors, as the same interconnect fabric and protocol layer can accommodate diverse communication needs without requiring separate specialized channels for each socket pair
Solution Approach 2:
The patent introduces intermediate control logic and protocol layers that mediate between multiple processor sockets and the interconnect fabric. These intermediary components manage arbitration, routing, and protocol translation, allowing multiple processors to communicate efficiently without direct peer-to-peer complexity. The intermediary layer abstracts the communication complexity, enabling scalable addition of processors while maintaining manageable communication overhead
3Adaptability or versatility
If vendor-specific interconnect protocols are used, then optimization for specific hardware is achieved, but interoperability across different vendors and technology nodes is lost
Solution Approach 1:
The patent creates a universal interconnect protocol layer that can operate across different vendor hardware and technology nodes. This protocol layer provides standardized interfaces and abstraction that enable interoperability between diverse components while maintaining the ability to optimize performance through configuration options and hardware-specific implementations at lower protocol layers
Solution Approach 2:
The patent employs parameterizable protocol configurations that can be adjusted to optimize performance for different hardware platforms and technology nodes. By making key protocol parameters configurable rather than fixed, the system can adapt to varying performance requirements of different vendors' hardware while maintaining a common protocol framework that ensures interoperability across the ecosystem
Data Source
AI summary
A port is to couple to another die over a die-to-die (D2D) link and includes a die-to-die (D2D) adapter to determine, from a set of registers, a set of capabilities of the D2D adapter to advertise in a negotiation with a link partner D2D adapter, where the D2D adapter is on a die and the link partner D2D adapter is located on a remote link partner die. A first capabilities advertisement message is sent to the link partner D2D adapter to advertise the set of capabilities to the link partner D2D adapter. A second capabilities advertisement message is received from the link partner D2D adapter, wherein the second capabilities advertisement message identifies a set of capabilities of the link partner D2D adapter. A final configuration of a D2D link is determined to couple the die to the link partner die.