Dam Structure Prevents Mounting Compound Overflow in IC Packaging
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Solution Overview
Problem
Existing methods for mounting integrated device dies to carriers often result in unwanted overflow of mounting compounds, such as underfill or adhesives, which can interfere with adjacent components and are challenging to control due to stand-off gap variations during thermal processes.
Innovation Solution
Incorporating a dam structure, typically made of non-conductive epoxy, between the carrier and the integrated device die to prevent overflow of the mounting compound, which can be inset from the outer side edge and have a specific shape or thickness to effectively contain the compound within the desired boundaries.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mounting compound is applied between the die and carrier, then the die is securely attached to the carrier, but the mounting compound may extend past the lateral side edges of the die which interferes with adjacent components
Solution Approach 1:
A dam structure made of non-conductive epoxy is introduced as an intermediary element between the mounting compound and the lateral side edges of the die. This dam structure acts as a barrier that prevents the mounting compound from extending past the die edges while still allowing the compound to fulfill its attachment function between the die and carrier.
Solution Approach 2:
The mounting compound application is segmented into two distinct zones: a first region where the compound is applied for secure attachment, and a second region near the lateral side edges where the dam structure prevents compound extension. This segmentation ensures that the compound remains confined to appropriate areas.
2Manufacturing precision
If the mounting compound is allowed to flow freely, then complete coverage is achieved, but control over compound distribution becomes difficult due to stand-off gap variations
Solution Approach 1:
The dam structure is formed in advance on the carrier before the mounting compound is applied. This preliminary action creates pre-defined boundaries that guide and control the compound flow, compensating for stand-off gap variations and ensuring precise compound distribution without requiring complex control mechanisms.
3Manufacturing precision
If a dam structure is added to prevent compound overflow, then compound distribution is controlled, but the device structure becomes more complex
Solution Approach 1:
The dam structure's parameters (such as height, width, and material properties of the non-conductive epoxy) are optimized to provide effective compound containment with minimal structural complexity. The dam structure is designed with specific dimensional parameters that balance containment effectiveness with simplicity of implementation.
Data Source
AI summary
An electronic module is disclosed. The electronic module can include a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have a first sidewall and a second sidewall opposite the first sidewall. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate. The dam structure can be positioned between the mounting compound and the outer side edge of the integrated device die.