Dam Wall Layout Between Conductive Wires to Prevent Side-Print Shorts
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Solution Overview
Problem
In the manufacturing process of border-free electronic devices, short circuits between conductive wires can occur, leading to reduced quality due to issues like wider second conductive wires, shifted wires, and capillary phenomena during the side printing process.
Innovation Solution
Incorporating dam walls between adjacent conductive wires, which are designed to be thicker than the conductive wires themselves, to prevent contact and shorts by separating the conductive wires and guiding the metal paste during the side printing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dam walls are added between adjacent conductive wires to prevent short circuits, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent introduces dam walls as intermediary structures positioned between adjacent conductive wires. These dam walls act as protective barriers that prevent direct contact between wires, thereby eliminating short circuit risks without requiring changes to the conductive wires themselves or the substrate design.
Solution Approach 2:
The patent segments the space between conductive wires by introducing discrete dam wall structures. Each dam wall is positioned at specific locations between adjacent wires, creating isolated zones that prevent electrical contact while maintaining the overall integrity of the conductive wire array.
2Manufacturing precision
If the distance between dam walls is reduced to less than the width of second conductive wires, then manufacturing precision is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent specifies a precise parameter relationship: the distance between adjacent dam walls is controlled to be less than the width of the second conductive wires. This parameter control ensures that during the side printing process, the metal paste forming the second conductive wires cannot bridge across to adjacent wires, as the dam walls create physical barriers within the paste flow path.
Solution Approach 2:
The dam walls are positioned in advance to preemptively block the metal paste flow during the side printing process. By placing dam walls at calculated positions before printing, the patent prevents the capillary action and paste spread that would otherwise cause short circuits, thereby eliminating the need for post-manufacturing corrections.
3Reliability
If thicker dam walls are used to prevent contact between conductive wires, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent establishes specific dimensional parameters for the dam walls, including their thickness and spacing. The dam wall thickness is designed to be sufficient to block metal paste flow, while the spacing between dam walls is controlled to be less than the width of second conductive wires. These parameter specifications provide clear manufacturing guidelines that balance reliability requirements with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dam walls effectively reduce the likelihood of short circuits, improving the quality of the electronic device by maintaining electrical connections and preventing contact between conductive wires under abnormal printing conditions.
Implementation Method 1
a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively
Implementation Method 2
issues like wider second conductive wires, shifted wires, and capillary phenomena during the side printing process
Data Source
AI summary
An electronic device includes a first substrate including a first surface and a first side-surface adjacent to the first surface, a second substrate including a second surface and a second side-surface adjacent to the second surface, a plurality of first conductive wires disposed on the first surface, a plurality of dam walls disposed on the first surface and located between any adjacent two of the first conductive wires respectively and a plurality of second conductive wires disposed on the first side-surface and the second side-surface. The plurality of first conductive wires are electrically connected to the plurality of second conductive wires respectively.