Damage Buffer Layer for Laser Patterning Solar Cell Metal Foils

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Solution Overview

Problem

Current laser-based metal patterning for solar cells faces challenges in achieving high-throughput, cost-effective, and damage-free processing, particularly with thick or highly reflective metals like aluminum, which can lead to laser damage to underlying cell components.

Innovation Solution

The use of a damage buffer material, such as a dielectric laser stop layer with inorganic binders and opacifying pigments, to protect the solar cell during laser patterning, allowing for thicker buffers and maintaining good contact between metal layers while preventing damage, and enabling the use of more powerful lasers for faster processing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser-based metal patterning is used for thick or highly reflective metals like aluminum, then high-throughput processing is achieved, but laser damage to underlying cell components occurs

Engineering Contradiction:
Improveprocessing throughputVSAvoidlaser damage to cell components
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A damage buffer layer is introduced as an intermediary between the metal foil and the solar cell. This buffer layer absorbs excess laser energy during patterning, preventing the energy from reaching and damaging the underlying cell components. The buffer layer acts as a mediator that protects the cell while allowing the laser processing to proceed at high throughput.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The damage buffer layer is applied beforehand to the solar cell surface before metal foil attachment. This pre-positioned cushioning layer is specifically designed to absorb laser energy that would otherwise damage the cell during subsequent patterning operations, enabling high-power laser processing without harm to the underlying structure.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

2Object-affected harmful factors

If a damage buffer layer is introduced to protect the cell, then laser damage is prevented, but the complexity of the manufacturing process increases

Engineering Contradiction:
Improvelaser damage preventionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The damage buffer layer application is merged with the existing metal foil attachment process. The buffer layer is applied as part of the same processing sequence where metal foil is attached to the cell, combining two functions into one integrated step rather than adding a separate, independent process stage.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The damage buffer layer serves multiple functions: it protects the cell from laser damage, provides a surface for metal foil attachment, and can be removed or retained based on final product requirements. This multi-functionality reduces the need for additional specialized layers or processes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If powerful lasers are used for faster processing, then productivity increases, but the risk of damage to the solar cell increases

Engineering Contradiction:
Improveprocessing speedVSAvoidrisk of solar cell damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The damage buffer layer serves as a mediator that enables the use of high-power lasers by absorbing the excess energy that would otherwise damage the cell. This allows operators to use laser powers sufficient for high-speed processing without increasing the actual damage risk to the underlying cell structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The introduction of the damage buffer layer changes the energy absorption parameters of the system. The buffer layer has specific optical properties that allow it to absorb laser energy at the processing wavelength, fundamentally changing how the laser energy is distributed and enabling higher power settings without proportional increases in damage risk.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables damage-free metal patterning, maintains high throughput, and reduces the risk of laser damage to the solar cell, while allowing for efficient isolation and welding of metal layers, thereby improving the manufacturing efficiency and reducing costs.

Implementation Method 1

a damage buffer material, such as a dielectric laser stop layer with inorganic binders and opacifying pigments, to protect the solar cell during laser patterning

Methodology Applied
Scientific EffectLaser absorption: Absorption (EM radiation)

Implementation Method 2

patterning a first surface of a metal foil by laser ablating the metal foil to provide a patterned metal foil having a plurality of alternating conductive regions and non-conductive regions

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentEP3235011B1Thick damage buffer for foil-based metallization of solar cells
Publication Date: 2022.04.20 MAXEON SOLAR PTE LTD
  • EP3235011B1 patent drawingFigure 1A~1C
  • EP3235011B1 patent drawingFigure 1D~1E
  • EP3235011B1 patent drawingFigure 1F~1G

AI summary

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. A method involves patterning a first surface of a metal foil to provide a plurality of alternating grooves and ridges in the metal foil. Non-conductive material regions are formed in the grooves in the metal foil. The metal foil is located above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate to provide the non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions and to provide the ridges in alignment with the alternating N-type and P-type semiconductor regions. The ridges of the metal foil are adhered to the alternating N-type and P-type semiconductor regions. The metal foil is patterned through the metal foil from a second surface of the metal foil at regions in alignment with the non-conductive material regions.