Damage Detection System Using Sensor Network and Power Interlock
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Solution Overview
Problem
Semiconductor packages in computer equipment are prone to damage from forces applied during assembly, transportation, and maintenance, which can lead to malfunction or catastrophic failure, and these damages often go undetected until the equipment is powered on, posing safety risks and potential for further damage.
Innovation Solution
A network of internal sensors coupled with a power interlock mechanism that detects excessive forces at serviceable locations and prevents the equipment from powering on if damage is detected, prompting a servicer to inspect and take corrective action.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor packages are protected without sensors, then device complexity is low, but reliability is poor because damage goes undetected until power on
Solution Approach 1:
The sensor network detects damage to semiconductor packages before the equipment is powered on, during the assembly or transportation phase. By performing the detection action in advance (before power-on), the system prevents catastrophic failures that would occur if damage were only detected after powering on, thus improving reliability without requiring complex real-time monitoring during operation.
Solution Approach 2:
A power interlock mechanism serves as an intermediary between the sensor network and the power-on sequence. The sensors detect damage and send signals to the power interlock, which then prevents the equipment from powering on. This intermediary component translates sensor data into actionable power control, resolving the contradiction by adding minimal complexity while achieving reliable damage detection and prevention.
2Reliability
If sensors are added to detect damage, then reliability improves, but ease of manufacture deteriorates due to additional components
Solution Approach 1:
The sensor network is designed to detect multiple types of damage (physical damage, thermal damage, mechanical stress) using a unified sensing architecture. This multi-functional approach allows a single sensor system to perform various detection tasks, improving reliability across different damage scenarios while avoiding the need for multiple separate detection systems that would complicate manufacturing.
Solution Approach 2:
The system includes automatic fault logging and notification capabilities that operate without continuous human intervention. When damage is detected, the system automatically logs the fault, identifies the affected semiconductor package, and notifies relevant personnel. This self-service functionality reduces the manual inspection and documentation burden, partially offsetting the increased manufacturing complexity with automated processes.
3Object-affected harmful factors
If power on sequence is aborted on damage detection, then safety improves, but productivity decreases due to delayed operation
Solution Approach 1:
The power interlock mechanism applies preliminary anti-action by preventing the power-on sequence from completing when damage is detected. Instead of allowing the equipment to power on and then fail catastrophically, the system proactively blocks the power-on process itself. This preliminary protective action prevents harmful effects (catastrophic failure, safety hazards) before they can occur, justifying the temporary productivity loss as a necessary safety measure.
Solution Approach 2:
The system implements continuous feedback between the sensor network, power interlock mechanism, and notification system. Sensors monitor for damage and provide feedback to the power interlock, which adjusts power delivery accordingly. When damage is detected, the feedback loop immediately triggers a power-on abort and notifies operators. This closed-loop feedback ensures that productivity losses are minimized by quickly identifying and responding to damage, preventing extended downtime from catastrophic failures.
Data Source
AI summary
A method includes initiating a power on sequence of a computer equipment including a plurality of sensors at a serviceable location within a component of the computer equipment, the plurality of sensors communicating with a sensor monitor coupled with an interlock mechanism, and a service console capable of communicating with the sensor monitor, receiving feedback data from the plurality of sensors during the power on sequence, each of the plurality of sensors is detecting a physical condition at the serviceable location, determining whether the feedback data exceeds a predefined threshold value, the feedback data exceeding the predefined threshold value is associated with a fault at a serviceable location, in response to the feedback data exceeding the predefined threshold value, logging the fault at the serviceable location, aborting the power on sequence of the equipment, and prompting an equipment servicer of the fault at the serviceable location.