Damped Bonding Surfaces for Ultrasonic Welding in Semiconductor Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for producing semiconductor components with molded-in pins face challenges in achieving high-quality ultrasonic welded joints due to undesirable vibrations and resonances, particularly when using high filler content materials, which are costly and require additional manufacturing steps.
Innovation Solution
The housing part design incorporates a recess or groove in the bearing surface, filled with a vibration-damping material, allowing for mechanical decoupling and damping of vibrations, thereby enhancing the quality of ultrasonic welded joints without additional manufacturing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high filler content material is used for the housing part, then temperature resistance is improved, but vibration damping capability deteriorates
Solution Approach 1:
The patent applies composite materials by combining the housing material (with filler content for temperature resistance) with a separate vibration-damping material applied to the bearing surface. This creates a composite structure where each material performs its specialized function: the housing material provides thermal stability while the damping material suppresses vibrations during ultrasonic welding.
Solution Approach 2:
The patent applies local quality by selectively applying vibration-damping material only to the bearing surface area where pins contact the housing, rather than throughout the entire housing structure. This localized approach provides vibration damping exactly where needed during ultrasonic welding while maintaining the overall structural integrity and temperature resistance of the housing material.
2Reliability
If two housing frame parts are manufactured and glued together to secure pins, then pin securing and vibration damping are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the functions of pin securing and vibration damping into a single integrated housing part structure. The bearing surface is formed as part of the monolithic housing, eliminating the need for separate housing frame parts and glue layers, while the applied vibration-damping material provides the necessary damping effect during ultrasonic welding.
Solution Approach 2:
The housing part is designed to provide its own vibration damping capability through the application of damping material directly to the bearing surface, eliminating the need for additional components or assembly steps. The housing structure itself serves the dual purpose of mechanical support and vibration suppression.
3Ease of manufacture
If pins are encapsulated with plastic material during injection molding, then manufacturing simplicity and cost are improved, but vibration damping capability deteriorates
Solution Approach 1:
The patent applies vibration-damping material to the bearing surface in advance, before the ultrasonic welding process begins. This preliminary action ensures that the damping material is in place to suppress vibrations during welding, while maintaining the manufacturing simplicity of the encapsulated pin structure.
Solution Approach 2:
The patent creates a composite surface structure where the plastic housing material (from injection molding) is combined with a specialized vibration-damping material applied to the bearing surface. This composite approach maintains the manufacturing advantages of injection molding while adding the necessary vibration damping capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables high-quality ultrasonic welded joints by damping undesirable vibrations, even in hard and inelastic housings with high filler content, using the same manufacturing process to create both bearing surfaces and damping effects, reducing costs and complexity.
Implementation Method 1
the housing part has a recess in the bearing surface or adjoining the bearing surface and the recess is at least partially filled with a vibration-damping material and/or vibration-damping material is applied in a region adjoining the recess
Implementation Method 2
A common method is ultrasonic wire bonding in which the bonding surfaces and the bonding wire are welded together by pressure and ultrasonic vibrations
Data Source
AI summary
A housing part for accommodating a semiconductor element includes a pin partially molded in the housing part for electrical connection to a printed circuit board. The pin includes a bonding surface for producing an electrical connection between the pin and the semiconductor element. The housing part includes a bearing surface for the bonding surface and a recess formed in the bearing surface or adjoining the bearing surface. A vibration-damping material is at least partially filled in the recess and/or applied in a region adjoining the recess. The housing part is designed as a one-piece housing frame part.