Damped Cooling Assembly for Heat Sink Oscillation Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance semiconductor chip packaging faces challenges with increased heat dissipation and I/O counts, leading to mechanical shock and potential damage from heavier heat sinks, which can cause the chip package to 'pop out' of the socket and damage I/O connections due to oscillatory movements.
Innovation Solution
Incorporating damping elements made of viscous materials, such as rubber or sorbothane, between the heat sink and the bolster plate to dampen oscillatory motion, reducing the amplitude of movements and minimizing damage to I/O connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heavier heat sinks are used to increase heat dissipation capacity, then thermal performance is improved, but mechanical shock and oscillatory movements increase causing chip package damage
Solution Approach 1:
The patent applies beforehand cushioning by introducing damping elements (viscoelastic materials, foam, or rubber) between the heat sink and bolster plate before assembly. These damping elements are pre-positioned to absorb and dissipate mechanical shock and oscillatory movements that will occur during operation, preventing the chip package from popping out of the socket while maintaining the heavy heat sink's thermal performance
2Reliability
If loading forces are increased to prevent chip package from popping out, then connection stability is improved, but oscillatory movements and mechanical shock are amplified
Solution Approach 1:
The patent uses damping elements as an intermediary component positioned between the heat sink and bolster plate. This intermediary layer decouples the direct mechanical connection, allowing loading forces to maintain connection stability while the damping material absorbs and dissipates oscillatory movements and mechanical shock, preventing their amplification
3Object-affected harmful factors
If spring elements are used to apply loading forces, then mechanical shock resistance is improved, but oscillatory movements are generated
Solution Approach 1:
The patent merges two opposing mechanical functions into a single integrated solution: spring elements provide the necessary loading forces and initial mechanical shock resistance, while damping elements simultaneously suppress the oscillatory movements generated by the spring elements. This combination achieves both mechanical shock resistance and oscillation control without requiring separate systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The addition of damping elements significantly reduces the number of damaging oscillations, thereby protecting the I/O connections between the chip package and the socket, enhancing the stability and reliability of the cooling assembly.
Implementation Method 1
Incorporating damping elements made of viscous materials, such as rubber or sorbothane, between the heat sink and the bolster plate to dampen oscillatory motion
Data Source
AI summary
An apparatus is described. The apparatus includes a semiconductor chip package assembly having a spring element to be coupled between a first mechanical element and a second mechanical element to apply a loading force that pulls the first and second mechanical elements toward each other in the assembly's nominal assembled state. The first and second elements to support a cooling mass, the assembly further comprising a dampener that is coupled to at least one of the first and second mechanical elements to reduce oscillation amplitude of the cooling mass.