Damper System for Lidless IC Shock Absorption
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Solution Overview
Problem
In compact computing environments with limited physical space, there is a challenge in designing compute units that efficiently use existing space while effectively managing heat generated by increasingly powerful integrated circuits, especially when traditional heatsinks are insufficient for heat removal.
Innovation Solution
The introduction of a damper installed between a heatsink and a lidless integrated circuit, which is compressed during heatsink installation, reduces the risk of damaging the integrated circuit during mounting and provides improved thermal performance by absorbing shock and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heatsink is installed directly on a lidless integrated circuit to improve heat removal, then thermal performance is improved, but the integrated circuit becomes susceptible to damage from mechanical stress and shock events
Solution Approach 1:
The patent introduces a lid with an integrated heatsink as an intermediary component between the integrated circuit and the external environment. This lid-heatsink assembly protects the integrated circuit from mechanical stress and shock events while simultaneously providing heat dissipation functionality through the heatsink portion, thus resolving the contradiction between thermal performance and reliability
Solution Approach 2:
The patent merges the protective lid function and the heat dissipation function into a single integrated component. The lid serves both as a mechanical protector for the lidless integrated circuit and as a mounting structure for the heatsink, eliminating the need for separate protective components and directly addressing the reliability-thermal performance contradiction
2Temperature
If traditional heatsinks are used in compact computing environments, then heat removal capability is limited, but the physical space constraints prevent adding additional cooling components
Solution Approach 1:
The lid serves multiple functions simultaneously: it provides mechanical protection for the integrated circuit, acts as a mounting structure for the heatsink, and contributes to the overall thermal management system. This multi-functionality allows effective heat removal in compact spaces without requiring additional dedicated cooling components
Solution Approach 2:
The patent combines the protective enclosure function and the thermal management function into a single integrated lid-heatsink assembly. This merging of functions maximizes the use of available space by eliminating redundant components and directly addressing the heat removal challenge in space-constrained environments
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The damper system effectively reduces the risk of integrated circuit damage from mechanical stress and shock events, while also improving thermal management by allowing for more efficient heat removal within the constrained space of compact computing environments.
Implementation Method 1
a damper installed between a heatsink and a lidless integrated circuit, which is compressed during heatsink installation, reduces the risk of damaging the integrated circuit during mounting and provides improved thermal performance by absorbing shock
Implementation Method 2
heatsink that removes heat from the integrated circuit, thereby allowing operation at a desired temperature and power level
Implementation Method 3
heatsink is in thermal communication with integrated circuit via only one thermal interface material
Data Source
AI summary
A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.