Portable Data Carrier Chip Integration via Insulating Fill
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Solution Overview
Problem
Existing methods for producing portable data carriers with chip modules are inefficient as they require separate production, leading to visible electrical contacts that are aesthetically disturbing and increase production costs due to tight position tolerances.
Innovation Solution
Integrating chip module production into data carrier production by filling the space between contacts and the data carrier body with an electrically insulating material, using lamination or injection molding processes, and creating recesses that match the chip and contact dimensions for a seamless fit, with optional adhesive application and transparent protective lacquer for insulation and aesthetics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chip modules are produced separately from data carriers and then installed, then the production process is flexible, but the electrical contacts remain visible and aesthetically disturbing
Solution Approach 1:
The patent combines the chip module production with the data carrier production into a single integrated process. The chip, contacts, and data carrier body are formed simultaneously in one manufacturing step, eliminating the need for separate production and assembly operations. This merging resolves the contradiction by maintaining production flexibility while achieving a seamless aesthetic appearance where contacts are not visible.
Solution Approach 2:
The patent performs preliminary actions by pre-forming the chip, contacts, and data carrier body structure in advance during the same manufacturing process. The contacts are formed and positioned before the final data carrier body is completed, allowing them to be subsequently covered or integrated into the design, thus achieving aesthetic appearance while maintaining manufacturing efficiency.
2Ease of manufacture
If chip modules are produced separately and installed later, then assembly is simple, but tight position tolerances are required increasing production costs
Solution Approach 1:
By merging chip module production with data carrier production into a single process, the patent eliminates the need for separate assembly operations. The chip and contacts are formed in their final positions during the same manufacturing step as the data carrier body, thereby achieving both assembly simplicity and relaxed position tolerances, reducing production costs.
Solution Approach 2:
The patent performs preliminary positioning and formation of the chip and contacts during the initial manufacturing stage. By pre-establishing their positions within the data carrier body structure before final assembly, the patent eliminates the need for tight position tolerances during subsequent assembly operations, simplifying the manufacturing process and reducing costs.
3Ease of operation
If contacts are made visible on the data carrier surface, then electrical connection is simplified, but the optical impression is disturbed
Solution Approach 1:
The patent introduces an intermediate layer or covering structure between the visible surface of the data carrier and the electrical contacts. This intermediary element allows the contacts to remain functional for electrical connection while being hidden from view, thus resolving the contradiction between ease of electrical connection and aesthetic appearance.
Solution Approach 2:
The patent employs thin film or shell structures that can cover the electrical contacts while maintaining their functionality. These flexible covering layers allow electrical connection to be maintained through the film (via conductive paths or contact points) while hiding the contacts from visual inspection, thus preserving optical appearance without compromising electrical connection ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables cost-effective production of data carriers with integrated chip modules that are visually unobtrusive and suitable for inline processes, allowing for efficient and aesthetically pleasing dual-interface cards with contactless and contact-based communication capabilities.
Implementation Method 1
an intermediate space between the at least one contact and the data carrier body is filled with an electrically insulating material
Implementation Method 2
an adhesive is dispensed into the recess or applied to the chip in order to fix the chip in the data carrier body
Data Source
AI summary
The present invention discloses a method for manufacturing a portable data carrier 26 with a chip 2, characterized by the following steps: applying at least one electrically conductive layer 6 to the surface of the chip 2 over at least one terminal 4 of the chip 2, such that an electrically conductive connection exists between the applied layer 6 and the terminal 4 of the chip 2, wherein the area of the applied layer 6 is larger than the area of the terminal 4 of the chip 2, wherein there is no electrically conductive connection between the terminals of the chip 2 on the surface; manufacturing a data carrier body 24; manufacturing at least one recess 14 in the data carrier body 24; inserting the chip 2 into the recess 14; and manufacturing at least one contact 20.which is located on the surface of the data carrier body and has an electrically conductive connection with each of the electrically conductive layers 6 applied to the chip 2, on which the contact 20 is arranged, wherein there is no electrically conductive connection between the terminals of the chip 2 and a space between the at least one contact 20 and the data carrier body 24 is filled with an electrically insulating material 22, so that a flat surface with the surface of the data carrier body 24 is formed.