Data Center Building Structure with Rack-Level Heat Exchanger Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional data center building designs face inefficiencies in cooling systems, including high energy consumption, limited size due to airflow requirements, and expensive raised floor architectures, which restrict the packing density and scalability of computer hardware racks.
Innovation Solution
A data center building structure utilizing high-bay warehouses without raised floors, featuring a primary cooling loop with heat exchanger devices connected to each rack to dissipate heat directly, eliminating the need for cross-rack air ducting and allowing for flexible, multi-level rack arrangements with individual cooling control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by stationary object
If a raised floor architecture with cold air passage is used for cooling, then cooling function is provided, but energy consumption increases and building cost increases
Solution Approach 1:
The cooling system is segmented into individual rack-level heat exchangers rather than a centralized cold air passage system. Each rack has its own heat exchanger device that independently removes heat, eliminating the need for raised floors and global airflow control infrastructure.
Solution Approach 2:
The heat exchanger devices are extracted from the traditional air cooling infrastructure and integrated directly at the rack level. This removes the dependency on raised floor architectures and cold air passages, allowing conventional flooring to be used instead.
2Temperature
If cold air is pumped through raised floor to cool racks, then cooling is achieved, but air flow rate must be large causing pumping losses
Solution Approach 1:
The mechanical air pumping system is replaced with a liquid-based heat exchange system. Heat exchangers use liquid coolant circulation instead of high-volume air pumping, significantly reducing the energy required to move the cooling medium through the system.
Solution Approach 2:
The system transitions from pneumatic cooling (air flow through raised floors) to hydraulic cooling (liquid coolant through heat exchangers). Liquid coolant provides higher heat capacity and more efficient heat transfer, reducing the volume and pumping power required.
3Use of energy by stationary object
If air cooling system is used, then cooling function is provided, but 40% power dissipation occurs
Solution Approach 1:
The system replaces air cooling with liquid coolant-based heat exchangers. Liquid coolant has higher heat capacity and thermal conductivity, enabling more efficient heat removal with lower power consumption for the cooling system.
4Ease of operation
If raised floor architecture is used for cooling, then cooling air distribution is enabled, but building volume is wasted
Solution Approach 1:
The cooling function is segmented to the rack level with individual heat exchangers, eliminating the need for raised floor structures. This allows the full building volume to be utilized for rack placement and equipment storage.
5Temperature
If closed cold air passage is used to prevent warm air short-circuiting, then cooling efficiency is improved, but rack design becomes complex and airflow control is required
Solution Approach 1:
The heat exchanger devices are extracted and integrated directly into each rack, eliminating the need for closed cold air passages and complex airflow control mechanisms. Each rack becomes an independent cooling zone with its own heat exchanger.
Solution Approach 2:
Cooling is localized to each rack with individual heat exchangers, allowing each rack to be optimized independently without requiring complex global airflow management or closed passage designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances energy efficiency, reduces costs, and increases packing density and scalability by using liquid coolants with high heat capacity, minimizing temperature differences, and eliminating the need for global airflow control, thereby optimizing cooling and reducing power consumption.
Implementation Method 1
heat exchanger devices which are designed to transfer all the heat generated by the computer hardware to the coolant
Implementation Method 2
The coolant is conveyed under atmospheric pressure or even under reduced pressure... the first cooling circuit is designed to supply all racks with a coolant, and the first cooling circuit is also designed to transport the coolant heated by the computer hardware away from all racks
Data Source
AI summary
The invention relates to a structure of a multi-storey computer centre building which is suitable for accommodating a multiplicity of racks (202), each of which comprises storage space for computer hardware (101), wherein the building has a first cooling circuit (205) in order to dissipate heat generated by the computer hardware (101), wherein the first cooling circuit (205) is designed to supply at least some of the racks (202) with a coolant and the first cooling circuit is also designed to remove the heated coolant from at least some of the racks (201), wherein said racks (202) have heat exchanger devices (206, 207) which are suitable for transferring the generated heat to the coolant.