Optimized air cooling unit

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Solution Overview

Problem

Current data center cooling systems face challenges with high airflow resistance, non-uniform airflow distribution, and temperature gradients, leading to inefficient cooling and potential hot spots due to their hardware component-intensive nature and non-uniform thermal environments.

Innovation Solution

A cooling unit with a fan section, airstream diversion sections, and multiple cooling sections, including main and rear cooling sections, is deployed to direct airflow uniformly across components, utilizing airstream diversion channels and coils connected in series to manage airflow and cooling fluid distribution, thereby reducing temperature gradients and improving thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional cooling systems with front-to-rear airflow are used, then cooling is provided to electronic components, but temperature gradient from front end to rear end becomes high and non-uniform

Engineering Contradiction:
Improvetemperature uniformityVSAvoidcooling system structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is segmented into multiple independent cooling modules, each responsible for a specific zone (front, middle, rear sections). Each module has its own airflow inlet, cooling channels, and outlets, allowing independent temperature control for different regions of the electronic rack, thereby eliminating the temperature gradient issue while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

2Productivity

If hardware components are densely packed to increase computing power, then processing capability improves, but airflow resistance increases and airflow distribution becomes non-uniform

Engineering Contradiction:
Improvecomputing powerVSAvoidairflow resistance
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The cooling system provides localized cooling with different airflow rates and cooling capacities tailored to specific high-heat-generation zones. The cooling modules are configured with varying numbers of fans and cooling channels according to the thermal density of each region, optimizing cooling efficiency while minimizing overall airflow resistance and energy loss.

Inventive Principle:
Principle #3Local quality

3Temperature

If cooling modules are added to reduce temperature gradients, then temperature uniformity improves, but device complexity increases

Engineering Contradiction:
Improvetemperature distribution uniformityVSAvoidcooling system configuration
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The cooling system is divided into standardized, modular cooling units that can be independently configured and maintained. Each module is a self-contained unit with standardized interfaces, making the system easier to manage and maintain despite having multiple modules. The modular design allows for scalable deployment based on specific cooling requirements without proportionally increasing overall system complexity.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances cooling efficiency, prevents hot spots, and ensures more uniform thermal environments for data center components, improving the reliability and performance of data center operations by optimizing airflow distribution and thermal management.

Implementation Method 1

a fan section, an airstream diversion section and a set of cooling sections, wherein the fan section includes one or more fans

Methodology Applied
Scientific EffectForced Convection: Forced Convection

Implementation Method 2

The plurality of rows of coils may be connected in series. Thus, a cooling liquid or coolant may be supplied to the plurality of rows of coils in series

Methodology Applied
Scientific EffectHeat Exchanger: Heat Exchanger

Data Source

PatentUS11740003B2Optimized air cooling unit
Publication Date: 2023.08.29 BAIDU USA LLC
  • US11740003B2 patent drawing
  • US11740003B2 patent drawing
  • US11740003B2 patent drawing

AI summary

A cooling unit for a data center comprises a fan section, a set of airstream diversion sections, and a set of cooling sections. The fan section is disposed at a front end of the unit. The set of airstream diversion sections includes one or more main airstream diversion channels and a rear airstream diversion channel. The airstream diversion section is configured to direct airflow from the fan section to the set of cooling sections. The set of cooling sections includes a main cooling section disposed at a side of the unit and a rear cooling section disposed at a rear end of the unit. Cooling modules may be arranged in series within each cooling section and among multiple cooling sections to manage a cooling fluid distribution corresponding to hot air inlets, to achieve more uniform temperature and better thermal management.