Dynamic Data Center Partitions for Hot Spot Cooling Control

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Solution Overview

Problem

Current data center climate control systems are inefficient, leading to increased operational costs and energy waste due to cooling the entire data center to below the set point to accommodate moving hot spots, which also increases the load on HVAC units.

Innovation Solution

A method and system that perform a thermal analysis of the data center, dynamically controlling moveable ceiling, floor, and wall partitions to concentrate cooling capacity and airflow to specific areas, reducing the strain on HVAC units and optimizing temperature distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the entire data center is cooled to below the set point to accommodate moving hot spots, then equipment reliability is improved, but energy consumption increases and operational costs rise

Engineering Contradiction:
Improveequipment reliabilityVSAvoidenergy consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The data center is divided into multiple thermal zones using movable partitions (walls, ceilings, floors) that can be dynamically reconfigured. Temperature sensors monitor hot spots and trigger partition movements to isolate affected areas, allowing different zones to be cooled to different temperatures. This segmentation enables selective cooling of only the necessary zones rather than cooling the entire data center, thereby maintaining equipment reliability while reducing overall energy consumption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The partition system is designed to be dynamic and reconfigurable, allowing the data center layout to change in real-time based on thermal conditions. Movable walls, ceilings, and floors can be adjusted to create barriers that contain hot spots and redirect airflow to where it is most needed. This dynamic adaptation enables the cooling system to respond to changing thermal patterns without requiring uniform over-cooling of the entire space, thus improving reliability while reducing energy waste.

Inventive Principle:
Principle #15Dynamics

2Temperature

If conventional cooling systems cool the entire data center to below the set point, then hot spots are prevented, but the load on HVAC units increases

Engineering Contradiction:
Improvetemperature uniformityVSAvoidHVAC load
Core Design Contradiction:
TemperatureVSPower

Solution Approach 1:

The data center is divided into multiple thermal zones using movable partitions (walls, ceilings, floors) that can be dynamically reconfigured. Temperature sensors monitor hot spots and trigger partition movements to isolate affected areas, allowing different zones to be cooled to different temperatures. This segmentation enables selective cooling of only the necessary zones rather than cooling the entire data center, thereby maintaining equipment reliability while reducing overall energy consumption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different zones within the data center are allowed to have different temperature characteristics based on local thermal conditions. The system identifies hot spots and creates localized cooling zones by moving partitions to concentrate cooling capacity where needed. This local quality approach allows critical areas to be cooled to appropriate temperatures while other areas can operate at higher temperatures, reducing the overall HVAC load while maintaining necessary temperature uniformity in critical zones.

Inventive Principle:
Principle #3Local quality

3Ease of operation

If hot air is allowed to diffuse to cooler regions, then natural convection occurs, but the cooling load on HVAC units increases

Engineering Contradiction:
Improvenatural convectionVSAvoidcooling load
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The system extracts and contains hot air in designated hot zones by moving partitions to create thermal barriers. Temperature sensors detect rising temperatures in specific areas, and the partition system responds by creating enclosed zones that trap hot air, preventing its diffusion into cooler regions. This extraction and containment of hot air maintains natural convection within isolated zones while protecting the overall cooling efficiency of the data center, thereby reducing the energy loss associated with continuous HVAC operation.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves airflow and temperature management within the data center, reduces energy consumption, and extends the mean-time to failure for critical systems by efficiently utilizing cooling resources and shielding computing resources from hot spots.

Implementation Method 1

dynamically controlling moveable ceiling, floor, and wall partitions to concentrate cooling capacity and airflow to specific areas

Methodology Applied
Scientific EffectAirflow:

Implementation Method 2

perform a thermal analysis of a data center to identify cooler regions of the data center and hotter regions of the data center

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS8983675B2System and method to dynamically change data center partitions
Publication Date: 2015.03.17 KYNDRYL INC
  • US8983675B2 patent drawing
  • US8983675B2 patent drawing
  • US8983675B2 patent drawing

AI summary

A method implemented in a computer infrastructure having computer executable code embodied on a computer readable medium being operable to perform a thermal analysis of a data center and overlay the thermal analysis on a map of the data center to provide an overlaid thermal analysis. Additionally, the computer executable code is operable to dynamically control at least one partition in the data center based on the overlaid thermal analysis.