Data Center Micro-Module Segmentation for Rapid Deployment

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Solution Overview

Problem

Existing data center construction methods result in excessively long construction cycles and high costs, with inflexible hardware architecture and compromised security and reliability due to the integration of building, electromechanical, and IT systems.

Innovation Solution

A data center micro-module integrating a computing server, power supply system, and cooling system within a single module, allowing for rapid assembly and flexible configuration of hardware architecture by connecting multiple modules.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional data center construction methods are used, then building, electromechanical, and IT systems can be integrated, but the construction cycle becomes excessively long and costs increase

Engineering Contradiction:
Improveconstruction speedVSAvoidconstruction cycle
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The data center system is divided into independent micro-modules, each containing a cabinet system, power supply system, and cooling system. These modular units can be manufactured separately and assembled quickly, eliminating the sequential dependency of conventional construction methods and dramatically reducing the construction cycle.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The micro-modules are pre-assembled and pre-tested in factory settings before deployment. The cabinet systems, power supplies, and cooling systems are configured and integrated in advance, allowing for rapid on-site assembly and significantly reducing the on-site construction time.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If building, electromechanical, and IT systems are integrated in conventional data centers, then a complete system is achieved, but the system becomes complicated and lacks security and reliability assurance

Engineering Contradiction:
Improvesystem reliabilityVSAvoidsystem complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

By segmenting the data center into standardized micro-modules with clearly defined interfaces, the system complexity is managed through modularity. Each module is independently designed, tested, and certified, which simplifies the overall system architecture while maintaining completeness of functions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The micro-modules are designed with built-in redundancy and fail-safe mechanisms. Power supply systems include backup capabilities, cooling systems have redundant pathways, and the modular architecture allows for isolated failure containment. This preliminary design of safety measures ensures reliability without adding operational complexity.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Adaptability or versatility

If conventional data centers are built, then hardware deployment is achieved, but hardware architecture becomes difficult to change and lacks flexibility

Engineering Contradiction:
Improvehardware flexibilityVSAvoidhardware reconfiguration difficulty
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The micro-module architecture enables dynamic reconfiguration of the data center. Modules can be easily added, removed, or relocated based on changing hardware requirements. The standardized interfaces and pre-configured systems allow for rapid adaptation to new deployment scenarios without extensive rework.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The segmented modular design allows individual micro-modules to be independently modified or upgraded. When hardware architecture changes are needed, only the affected modules require adjustment rather than the entire system, making reconfiguration straightforward and maintaining ease of operation.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9814162B2Data center micro-module and data center formed by micro-modules
Publication Date: 2017.11.07 TENCENT TECHNOLOGY (SHENZHEN) CO LTD
  • US9814162B2 patent drawing
  • US9814162B2 patent drawing
  • US9814162B2 patent drawing

AI summary

A data center micro-module includes: an enclosure, and a cabinet system, a power supply system, and a cooling system that are inside the enclosure. The cabinet system installs a computing server, the power supply system supplies power for the computing server and the cooling system, and the cooling system cools the computing server; and the enclosure is further externally provided with an interface configured to connect to another data center micro-module or connection apparatus. The foregoing data center micro-module integrates the power supply system, the cooling system and the computing server into a same module, and therefore can be directly manufactured in a factory. When a data center is built, the data center micro-modules only need to be combined and assembled, which greatly reduces a construction cycle of the data center, and the hardware architecture may be flexibly changed according to a specific deployment requirement.