Data Interleaving Module for Multi-Density Memory Alignment

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Solution Overview

Problem

Memory devices face challenges in supporting multiple memory densities without complex data-path designs, as existing technologies require different data-paths for each memory density, leading to inefficiencies in data alignment and transfer.

Innovation Solution

A data interleaving module that interleaves data received from a bus among modules according to selected memory densities, allowing for seamless data alignment and transfer to a register without the need for a specific data-path for each density, enabling support for various memory densities while maintaining data alignment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If different data-paths are used for each memory density, then data alignment is maintained, but device complexity increases

Engineering Contradiction:
Improvedata alignmentVSAvoiddata-path design
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A single data-path is designed to support multiple memory densities (SLC and various MLC configurations) through configurable parameters rather than requiring separate dedicated data-paths for each density type. The same physical infrastructure handles different data widths and alignment requirements by adjusting operational parameters.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The data-path incorporates dynamic configuration capabilities that allow it to adapt its behavior based on the selected memory density mode. Parameters such as data width, alignment offsets, and transfer timing can be dynamically adjusted to match the requirements of the currently active memory density configuration.

Inventive Principle:
Principle #15Dynamics

2Device complexity

If a single data-path supports multiple memory densities, then device complexity is reduced, but data alignment becomes difficult to maintain

Engineering Contradiction:
Improvedata-path designVSAvoiddata alignment
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The system maintains data alignment across multiple memory densities by dynamically changing operational parameters including data width, byte offsets, and transfer timing. Configuration registers allow software to set appropriate parameters for each memory density mode, ensuring proper alignment without requiring hardware-specific data-paths.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

Configuration registers and control logic act as intermediaries between the host system and the physical data-path, translating high-level memory density selections into specific parameter settings that maintain proper data alignment. This intermediary layer abstracts the complexity of alignment requirements from the host while preserving precise control over data transfer characteristics.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If memory devices support multiple data densities, then adaptability increases, but data-path design becomes overly complicated

Engineering Contradiction:
Improvememory density supportVSAvoiddata-path design
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The data-path is designed as a universal infrastructure that can operate with different memory densities (supporting both SLC and multiple MLC configurations) through parameter configuration rather than requiring separate dedicated paths for each density type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The memory system is segmented into configurable functional blocks with independent parameter settings, allowing each segment to be optimized for its specific memory density mode while sharing common infrastructure. This modular approach with configurable parameters reduces overall complexity compared to fully dedicated paths.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS9189440B2Data interleaving module
Publication Date: 2015.11.17 MICRON TECHNOLOGY INC
  • US9189440B2 patent drawing
  • US9189440B2 patent drawing
  • US9189440B2 patent drawing

AI summary

The present disclosure includes apparatuses and methods related to a data interleaving module. A number of methods can include interleaving data received from a bus among modules according to a selected one of a plurality of data densities per memory cell supported by an apparatus and transferring the interleaved data from the modules to a register.