Two-Dimensional Data Matrix Fabrication on PCB Copper Layers
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Solution Overview
Problem
Conventional methods for fabricating two-dimensional data matrix structures on copper surfaces require an extra off-line X-ray laser process, leading to increased space, time, and maintenance costs, radiation concerns, and inefficiencies due to laser light scattering and formation of undesired structures like volcanic holes and collapse issues.
Innovation Solution
A two-dimensional data matrix structure is created using a first and second metal layer on substrates with through and blind holes corresponding to a data matrix pattern, formed using a laser in a single step, with surface treatment to enhance efficiency and prevent undesired structures, and the layers are electrically insulated to improve yield and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an extra off-line X-ray laser process is used to capture the two-dimensional data matrix image, then the data matrix pattern can be formed, but space costs, time costs, and maintenance costs increase
Solution Approach 1:
The patent combines the data matrix pattern formation with the standard PCB manufacturing process by integrating it into the copper layer structure. The data matrix is formed by selectively removing copper in the same manufacturing line, eliminating the need for separate off-line X-ray laser processing and reducing both time and space costs.
Solution Approach 2:
The patent extracts the data matrix information from a separate imaging process and embeds it directly into the copper layer structure of the PCB. By using selective copper removal to create the pattern, the data matrix is integrated into the manufacturing process itself rather than being added as a separate post-processing step.
2Manufacturing precision
If an extra off-line X-ray laser process is used, then the data matrix pattern can be formed, but maintenance costs and radiation concerns increase
Solution Approach 1:
The patent converts the potentially harmful X-ray laser process into a benign chemical etching process. Instead of using ionizing radiation, the data matrix pattern is formed through selective chemical removal of copper using etchants, which eliminates radiation hazards while maintaining the ability to create precise patterns.
3Ease of manufacture
If surface treatment on the copper plate is not performed, then the process is simpler, but laser light scattering occurs and through hole formation efficiency degrades
Solution Approach 1:
The patent applies surface treatment to the copper layer before the laser drilling process to prepare the surface for optimal laser absorption. This preliminary action prevents laser light scattering and ensures efficient energy transfer during through hole formation, thereby improving productivity without significantly complicating the overall process.
4Ease of manufacture
If surface treatment on the copper plate is not performed, then the process is simpler, but undesired structures like volcanic holes and collapse problems occur
Solution Approach 1:
The patent applies surface treatment to the copper layer before laser drilling to prepare the surface for optimal laser absorption. This preliminary action prevents laser light scattering and ensures efficient energy transfer during through hole formation, thereby improving productivity without significantly complicating the overall process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces costs and radiation risks, enhances efficiency by forming the data matrix pattern in a single step, and prevents undesired structures, improving the product yield and safety by eliminating the need for extra off-line processes and X-ray lasers.
Implementation Method 1
forming a plurality of through holes in the first substrate, the second substrate and the second metal layer and forming a plurality of blind holes in the second substrate and the second metal layer by using a laser
Data Source
AI summary
A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.