Datacenter Spine Interconnect for Modular Liquid Cooling and Power
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Solution Overview
Problem
Existing datacenters face challenges in efficiently managing power, network, and cooling infrastructure due to their dependence on facility-specific setups, which limits modularity and scalability, especially when adding or scaling computing resources.
Innovation Solution
A spine interconnect device providing a modular solution with liquid-cooled electronic components, incorporating bus bars, tap-off boxes, power cables, and cooling conduits, decoupling infrastructure needs from facility architecture, allowing for flexible installation and expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If datacenters use facility-specific power and cooling infrastructure, then power delivery and heat dissipation can be achieved, but modularity and scalability are limited when adding computing resources
Solution Approach 1:
The patent segments the power and cooling infrastructure into modular units that can be independently deployed. Each module includes standardized power distribution components and cooling elements that can be added incrementally as computing resources are scaled, eliminating the need for facility-wide infrastructure changes.
Solution Approach 2:
The patent creates universal power and cooling modules that can serve multiple functions and be deployed in various facility types. These standardized modules provide both power delivery and cooling capabilities in an integrated manner, allowing the same infrastructure design to support different computing resource configurations without facility-specific customization.
2Productivity
If datacenters are expanded by adding computing resources, then processing capacity increases, but facility requirements and infrastructure changes are directly affected
Solution Approach 1:
The patent implements dynamic infrastructure modules that can be easily configured and reconfigured as computing resources are added or removed. The power distribution system uses movable bus bars and adjustable tap-off boxes that can adapt to changing load requirements without requiring permanent facility modifications.
Solution Approach 2:
The patent incorporates preliminary-designed standardized power and cooling modules that are pre-configured for specific computing resource densities. This allows facilities to be prepared in advance with modular units that can be quickly deployed when computing resources are added, eliminating the need for ad-hoc infrastructure design and installation.
3Power
If traditional power distribution with extensive cabling is used, then power can be delivered to computing resources, but heat generation and power consumption increase
Solution Approach 1:
The patent replaces traditional electrical cabling with hydraulic bus bars for power distribution. This liquid-based power transmission method reduces resistive losses and heat generation compared to extensive copper cabling, while maintaining efficient power delivery to computing resources through direct fluid-contact or proximity coupling.
Solution Approach 2:
The patent merges power distribution and cooling functions into a single integrated infrastructure. The same liquid medium used for power transmission via hydraulic bus bars also serves as the cooling fluid, eliminating the need for separate power cabling and cooling pipelines, thereby reducing overall power consumption and heat generation.
4Ease of operation
If extensive cabling is used for power and network connections, then computing resources can be interconnected, but heat dissipation requirements increase
Solution Approach 1:
The patent combines power distribution, cooling, and network interconnection functions into an integrated modular infrastructure. The hydraulic bus bars provide both power transmission and cooling fluid flow through the same physical pathway, reducing the total amount of cabling and piping required, thereby minimizing heat generation from multiple cable systems and simplifying heat dissipation management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient power and cooling infrastructure for liquid-cooled components without altering the facility, promoting modularity and cost-effective scaling of datacenters, suitable for various types of facilities.
Implementation Method 1
cold water conduit and a warm water return conduit disposed at a base of the spine support... for cooling the liquid-cooled electronic components
Implementation Method 2
pumping water through the cold water conduit to the liquid-cooled electronic components and extracting heat generated by the electronic components to the water
Implementation Method 3
a manifold fluidly connecting the cold water conduit and the warm water return conduit to the liquid-cooled electronic components
Implementation Method 4
connecting the cold water conduit and the warm water return conduit to a cooling system including a pump... pumping water through the cold water conduit to the liquid-cooled electronic components
Implementation Method 5
pumping the heated water to the external heat exchanger... extracting heat generated by the electronic components to the water and pumping the heated water to the external heat exchanger
Data Source
AI summary
A spine interconnect device for a datacenter with liquid-cooled electronic components. The spine interconnect device includes a first bus bar and a second bus bar. The first and second bus bars each include one or more high power conductors. The spine interconnect device further includes a spine support configured to suspend the first bus bar and the second bus bar above the electronic components and a plurality of tap-off boxes each with a plurality of power ports. Each tap-off box is connected to and supported by the first bus bar or the second bus bar. The spine interconnect device further includes a plurality of power cables interconnecting the plurality of power ports to the electronic components, a low power tray with networking cables, and a networking switch. The spine interconnect device further includes a cold water conduit and a warm water return conduit and a manifold.