Direct Bonded Copper Assembly Layout for Thermal Dissipation
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Solution Overview
Problem
Existing electronic assemblies with direct bonded copper substrates face challenges in thermal performance, leading to potential failure of electronic components due to excessive heating from heat-generating components.
Innovation Solution
The electronic assembly incorporates a dielectric layer with metallic buses, islands, and strips isolated by dielectric barriers, along with a current shunt resistor and heat sink, to enhance thermal dissipation and current handling capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If heat-generating components are integrated into the electronic assembly, then functional capability is improved, but thermal performance deteriorates due to excessive heating
Solution Approach 1:
The substrate is segmented into multiple metallic layers (first metallic layer, second metallic layer) with dielectric layers in between, creating a multi-layer structure that distributes heat generation across different planes and improves thermal management capability
Solution Approach 2:
Dielectric layers are introduced as intermediary materials between heat-generating components and the substrate, and between different metallic layers, providing both electrical isolation and thermal management pathways
2Temperature
If additional heat dissipation structures are added, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The metallic layers serve dual functions: they provide electrical conductivity for current flow and act as heat dissipation pathways, eliminating the need for separate dedicated heat sinks and reducing overall device complexity
Solution Approach 2:
The patent merges the electrical conduction function and thermal conduction function into the same metallic structures, so that the metallic layers simultaneously carry current and dissipate heat, reducing the number of separate components needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration improves thermal performance and current carrying capacity, maintaining components within operational temperature ranges and reducing the risk of failure.
Implementation Method 1
a first metallic bus overlying the dielectric layer, the first metallic bus having a bus width; a second metallic bus overlying the dielectric layer and generally parallel to the first metallic bus
Implementation Method 2
heat-generating components, such as semiconductors, current measurement devices, or both that generate thermal loads that can result in heating of the substrate and circuit traces
Data Source
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AI summary
A metallic island is disposed between a first metallic bus and a second metallic bus. The first metallic strip is isolated from the metallic island by a first dielectric barrier. At least a parallel portion of the first metallic strip is generally parallel to the first metallic bus, the second metallic strip isolated from the second metallic bus by a second dielectric barrier. Each first semiconductor terminals that are coupled to the first metallic bus and to the metallic island. Each second semiconductor has terminals coupled to the metallic island and to the second metallic bus.