DBC Substrate Micro-Structure Tabs for High-Power Cooling
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Solution Overview
Problem
Existing cooling systems for high-power devices on direct-bonded copper substrates face limitations in thermal dissipation due to restricted back-side cooling surface area and high costs, particularly with liquid impingement methods, which are either bulky or inefficient in heat transfer.
Innovation Solution
A cooling apparatus featuring a direct-bonded copper substrate with micro-structure tabs and a jet head equipped with micro-jets that direct a phase-change fluid to impinge on these tabs, enhancing heat transfer and vaporization for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid impingement cooling is used on DBC substrates, then heat transfer efficiency is improved, but the back-side cooling surface area is substantially reduced
Solution Approach 1:
The invention transitions from traditional two-dimensional flat plate cooling to three-dimensional micro-fin structures. The micro-fins extend perpendicular from the DBC substrate surface, creating additional cooling surfaces in the vertical dimension. This allows liquid impingement to occur on multiple surfaces (top, bottom, and lateral surfaces of fins) rather than just a flat plane, effectively increasing the heat transfer area without increasing the substrate footprint.
Solution Approach 2:
The cooling surface is segmented into multiple micro-fin elements rather than a single continuous plate. Each micro-fin acts as an independent heat transfer element that can be individually optimized for liquid flow and heat dissipation. The segmentation creates a阵列 of fin structures that collectively provide enhanced cooling surface area while maintaining compatibility with the DBC substrate geometry.
2Area of stationary object
If macro-scale fins are attached to DBC substrates, then cooling surface area is increased, but the liquid impingement path is blocked and cost increases
Solution Approach 1:
Instead of using uniform macro-scale fins across the entire substrate, the invention employs micro-fins with locally optimized dimensions and spacing. The fin height, thickness, and spacing are tailored to specific regions of the DBC substrate based on local heat generation patterns. This local quality approach ensures that liquid impingement paths remain open while maximizing heat transfer in high-heat-density areas, avoiding the blockage problems associated with uniform macro-fins.
Solution Approach 2:
The invention changes the scale parameters from macro-scale to micro-scale fin dimensions. By reducing fin size to the micro-scale range, the liquid flow channels remain unobstructed while the cumulative surface area of numerous micro-fins provides enhanced heat transfer. The parameter changes also include optimizing fin spacing and height ratios to balance surface area maximization with flow accessibility.
3Temperature
If custom-made base plates with surface structures are used, then heat transfer is enhanced, but system bulk and cost increase
Solution Approach 1:
The invention merges the cooling surface structures directly with the DBC substrate by forming micro-fins on the substrate surface itself, rather than attaching separate custom base plates. This integration eliminates the need for additional custom-made components, reducing system bulk and manufacturing cost while maintaining enhanced heat transfer performance. The micro-fins are formed as part of the substrate fabrication process, creating a unified thermal management solution.
Solution Approach 2:
The invention utilizes liquid impingement cooling where liquid coolant is directly sprayed or flowed over the micro-fin surfaces. The hydraulic design of the liquid delivery system is optimized to distribute coolant effectively across the micro-fin array, maximizing convective and evaporative heat transfer. This approach leverages fluid dynamics principles to achieve high heat transfer coefficients without requiring complex solid structure modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides more uniform temperature distribution and increased thermal dissipation for high-power devices while maintaining a compact and cost-effective system structure, improving upon existing methods by enhancing the cooling surface area and heat transfer efficiency.
Implementation Method 1
pumping a phase-change fluid to a jet head, directing the phase-change fluid through a plurality of discrete clusters of micro-jets in the jet head to impinge on respective regions of micro-structure tabs formed on a fluid impingement side of a direct-bonded copper ("DBC") substrate, and transferring excess heat from a plurality of heat sources to the phase-change fluid through the DBC substrate to create vapor and heated liquid
Data Source
AI summary
A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.