DBC Power Module Package for Thermal Isolation and Lower Resistance
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Solution Overview
Problem
The single piece heat slug structure in integrated circuit (IC) packages limits thermal performance, circuit topologies, power output, and package layout, and fails to provide external isolation, making it difficult to reduce thermal resistance and integrate with external systems.
Innovation Solution
A power module with a direct bonded copper (DBC) substrate, where the DBC substrate includes a patterned copper surface for mounting dies and a continuous copper surface thermally coupled to a heat slug, providing electrical isolation and reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single piece heat slug structure is used, then the structural simplicity is maintained, but the thermal resistance cannot be reduced below a desired value
Solution Approach 1:
The heat slug is divided into multiple separate heat slugs, each coupled to a specific die. This segmentation allows for optimized thermal paths from each heat-generating component to its dedicated heat sink, reducing overall thermal resistance while maintaining structural manageability.
Solution Approach 2:
A substrate is introduced as an intermediary component between the heat slugs and the dies. The substrate provides a platform for mounting both the dies and heat slugs, and facilitates thermal coupling through thermal interface materials, enabling efficient heat transfer while electrical isolation prevents short circuits.
2Ease of manufacture
If a single piece heat slug structure is used, then the manufacturing process is simplified, but circuit topologies and power output are limited
Solution Approach 1:
The heat slug assembly is segmented into multiple independent heat slugs that can be selectively positioned and coupled to different dies on the substrate. This modular approach enables flexible circuit topologies and power configurations while maintaining relatively simple manufacturing processes for each individual heat slug component.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for mounting dies and heat slugs, establishes electrical connections through conductive paths, provides electrical isolation between heat slugs and dies, and facilitates thermal management. This multi-functionality enables diverse circuit topologies without complicating the overall manufacturing process.
3Device complexity
If a single piece heat slug structure is used, then the package layout is constrained, but external isolation cannot be provided
Solution Approach 1:
The substrate acts as an intermediary that provides electrical isolation between the heat slugs and the dies through its insulating properties. This isolation prevents short circuits while allowing thermal coupling through dedicated thermal paths, enabling flexible package layouts without compromising electrical reliability.
Solution Approach 2:
The substrate provides localized thermal coupling regions where heat slugs contact dies through thermal interface materials, while maintaining electrical isolation in the same regions. This local differentiation of thermal and electrical properties enables flexible package layouts with proper isolation without increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves robust thermal performance with reduced thermal resistance (1.8 K/W to 1.47 K/W) and prevents electromagnetic interference and short circuits, enabling higher power output (3 kW to 10 kW) while allowing for various circuit architectures.
Implementation Method 1
The second surface of the DBC substrate is thermally coupled to the heat slug
Implementation Method 2
The die and the heat slug are thermally coupled and electrically isolated
Data Source
AI summary
A power module includes an interconnect of an integrated circuit (IC) package having a heat slug. The power module also includes a direct bonded copper (DBC) substrate. The DBC substrate has a first surface formed of pattern copper, the patterned copper has a pad and a second surface that opposes the first surface, the second surface has a sheet of copper. The second surface of the DBC substrate is thermally coupled to the heat slug. The power module further includes a die mounted on the pad of the first surface of the DBC substrate. The die has a power transistor. The die and the heat slug are thermally coupled and electrically isolated.