DBCOD NCF Die Bonding for Low-Warpage Semiconductor Packages
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving reliable and efficient bonding between dies due to warpage and non-uniform contact of solder layers, leading to electrical disconnections and reduced packaging performance.
Innovation Solution
Incorporating a non-conductive film (NCF) with a dibenzocyclooctadiene (DBCOD)-based compound between buffer and core dies, which reduces warpage and ensures complete contact and bonding through a thermocompression process, enhancing the coefficient of thermal expansion matching and improving electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging technologies are used for bonding dies, then the bonding process can be completed, but warpage and non-uniform contact of solder layers occur leading to electrical disconnections and reduced packaging performance
Solution Approach 1:
The patent changes the material composition of the NCF by incorporating DBCOD-based compounds, which modifies the thermal and mechanical properties of the bonding interface. This parameter change enables better thermal expansion matching and reduces warpage during thermocompression bonding, ensuring uniform contact of solder layers and reliable electrical connections.
Solution Approach 2:
The patent uses a composite NCF structure that includes DBCOD-based compounds combined with other materials to achieve optimal bonding properties. This composite approach allows the NCF to simultaneously provide mechanical support, thermal management, and dimensional stability during the bonding process, preventing warpage and ensuring uniform solder contact.
2Strength
If thermocompression process is used for bonding dies, then bonding can be achieved, but warpage occurs leading to non-uniform contact and electrical disconnections
Solution Approach 1:
The patent specifically addresses thermal expansion mismatch by incorporating DBCOD-based compounds in the NCF. These compounds have thermal expansion properties that match well with the dies and substrate, reducing warpage during the thermocompression process. The DBCOD-based NCF maintains dimensional stability under thermal cycling, preventing shape distortion while achieving strong bonding.
3Manufacturing precision
If NCF with DBCOD-based compound is used for bonding, then warpage is reduced and uniform contact is achieved, but the process complexity increases
Solution Approach 1:
The DBCOD-based NCF serves multiple functions simultaneously: it provides mechanical support, enables thermocompression bonding, manages thermal expansion, and ensures uniform solder contact. This multi-functionality reduces the need for additional separate components or process steps, thereby managing process complexity while achieving superior manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of DBCOD-based NCF improves the reliability and performance of semiconductor packages by ensuring consistent bonding and reduced warpage, enhancing electrical connections and thermal expansion matching, thereby increasing the process margin and reducing the risk of peeling at interfaces.
Implementation Method 1
enhancing the coefficient of thermal expansion matching
Implementation Method 2
bonded to each other through a thermocompression process
Data Source
AI summary
A semiconductor package includes a buffer die, a first core die disposed on the buffer die, and a non-conductive film (NCF) disposed between the buffer die and the first core die so that the buffer die and the first core die are bonded to each other, wherein the NCF includes a dibenzocyclooctadiene (DBCOD)-based compound.