DC-DC Converter Assembly with Partial Inductor Coverage

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Solution Overview

Problem

Conventional DC-DC converter layouts on printed circuit boards (PCBs) are inefficient due to the large size caused by attaching discrete power stage components and inductors in the same plane, complicating the electrical interconnections and making visual inspection of pins difficult.

Innovation Solution

The DC-DC converter design involves attaching discrete high-side and low-side power transistor dies to one side of a substrate, with an inductor covering at least one of the dies to create an output phase, allowing for easy visual inspection of uncovered pins and optimizing PCB space by using a substrate with metal traces for electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If discrete power stage components and inductors are attached in the same plane on PCB, then electrical interconnections can be established, but PCB size increases and visual inspection of pins becomes difficult

Engineering Contradiction:
ImprovePCB sizeVSAvoidvisual inspection of pins
Core Design Contradiction:
Area of stationary objectVSDifficulty of detecting and measuring

Solution Approach 1:

The patent applies dimensionality change by allowing inductors to be positioned in three-dimensional space above the PCB rather than strictly in the same plane as other components. This vertical arrangement reduces the horizontal footprint on the PCB while maintaining electrical connections through vias and traces, thereby reducing overall PCB size while keeping pin inspection accessible from the top surface.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If inductor covers discrete power stage transistor dies, then PCB space is optimized, but visual inspection of pins becomes difficult

Engineering Contradiction:
ImprovePCB space utilizationVSAvoidvisual inspection of pins
Core Design Contradiction:
Area of stationary objectVSDifficulty of detecting and measuring

Solution Approach 1:

The patent implements partial coverage where the inductor partially covers the discrete power stage transistor dies rather than completely obscuring them. This partial arrangement optimizes PCB space utilization by allowing compact positioning while leaving sufficient pin areas exposed for visual inspection and troubleshooting, balancing space efficiency with inspectability.

Inventive Principle:
Principle #16Partial or excessive action

3Ease of manufacture

If conventional layout design practices are followed, then electrical interconnections are established, but component arrangement becomes complicated

Engineering Contradiction:
Improvecomponent placement simplicityVSAvoidcomponent arrangement complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the inductor positioning with the power stage component arrangement by allowing the inductor to be positioned directly over or adjacent to the transistor dies. This integration simplifies the overall component layout by reducing the number of separate placement zones required, thereby improving ease of manufacture while maintaining clear electrical interconnection paths through the substrate.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11283356B2Method of assembling a DC-DC converter
Publication Date: 2022.03.22 INFINEON TECH AUSTRIA AG
  • US11283356B2 patent drawing
  • US11283356B2 patent drawing
  • US11283356B2 patent drawing

AI summary

A method of assembling a DC-DC converter includes: attaching first and second discrete power stage transistor dies to a first side of a substrate, the first discrete die including a high-side power transistor and the second discrete die including a low-side power transistor electrically connected to the high-side power transistor to form an output phase of the DC-DC converter; attaching an inductor to the first side of the substrate so as to electrically connect the output phase to a metal output trace on the substrate, the inductor partly covering at least one of the first and the second discrete power stage transistor dies such that each discrete power stage transistor die that is partly covered by the inductor comprises a plurality of pins that are not covered by the inductor; and visually inspecting the plurality of pins uncovered by the inductor.