DC-DC Converter Module Thermal Management via Orthogonal Through-Hole Conductors
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Solution Overview
Problem
Electronic component modules, such as those for DC-DC converters, face the challenge of heat generated in the substrate propagating to passive components, which can deteriorate their characteristics.
Innovation Solution
The module incorporates a substrate with through-hole conductors that oppose each other in a direction intersecting the terminals, allowing for increased heat dissipation and preventing heat propagation to passive components, while efficiently utilizing space for a smaller module design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate integrates circuit components and passive components on one main face side, then integration is achieved, but heat generated in the substrate propagates to passive components causing deterioration
Solution Approach 1:
The patent positions through-hole conductors in the substrate to oppose each other in a direction intersecting the direction in which terminals of passive components oppose each other. This orthogonal arrangement creates longer heat dissipation paths in the substrate thickness direction, effectively separating heat flow from passive components while maintaining planar integration.
Solution Approach 2:
The patent divides the substrate into multiple regions with through-hole conductors strategically positioned to segment heat flow paths. By creating multiple opposing through-hole conductors that extend in the thickness direction, heat is dissipated through multiple separate pathways rather than concentrating in single locations, preventing heat accumulation near passive components.
2Temperature
If through-hole conductors are positioned to oppose each other in an intersecting direction, then heat dissipation distance increases, but substrate space utilization becomes more complex
Solution Approach 1:
The through-hole conductors serve dual functions: they provide electrical connectivity between opposite surfaces of the substrate and simultaneously act as heat dissipation pathways. By making the conductors oppose each other in an intersecting direction, the same structural elements accomplish both signal transmission and thermal management, reducing the need for additional dedicated heat sinking structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively inhibits heat from the substrate from reaching passive components, maintaining their performance and enabling a compact module design by promoting heat dissipation through the leads and electrode layers.
Implementation Method 1
the distance between the first and second through-hole conductors can become longer, thereby promoting the dissipation of the heat generated from the first and second leads
Data Source
AI summary
In a DC-DC converter module, a first through-hole conductor provided in a substrate as a first lead for electrically connecting a terminal as a voltage output terminal of an IC and a first terminal of an inductor component to each other and a second through-hole conductor provided in the substrate as a second lead for electrically connecting a terminal as a switching terminal of the IC and a second terminal of the inductor component to each other oppose each other in a direction intersecting a direction in which the first and second terminals oppose each other in the inductor component (i.e., the longitudinal direction of the substrate and inductor component).