DC-DC Converter Resistor Dampens Parasitic Inductance
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Solution Overview
Problem
DC-DC converters face challenges in achieving high conversion efficiency due to parasitic inductances from bonding wires, which increase switching time and power dissipation, leading to thermal issues and reduced switching frequencies.
Innovation Solution
Incorporating a resistive element between the source terminal of the high-side transistor and the drain terminal of the low-side transistor to dampen voltage oscillations and reduce current flowing through parasitic inductors, allowing for faster switching and higher efficiency, even in packages with bonding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bonding wires are used to connect die pads to package pins, then the device complexity and manufacturing cost are reduced, but parasitic inductances increase leading to longer switching times and reduced conversion efficiency
Solution Approach 1:
A resistive element is introduced as an intermediary component between the high-side and low-side transistors. This resistor dampens voltage oscillations and reduces the impact of parasitic inductances from bonding wires, allowing standard packaged devices to achieve performance接近 to bond-free designs without requiring specialized packaging
2Loss of energy
If switching time is reduced to improve conversion efficiency, then power dissipation decreases, but voltage oscillations and electromagnetic interference increase
Solution Approach 1:
The resistive element converts the harmful voltage oscillations and electromagnetic interference into beneficial damping effects. By introducing controlled resistance, the system transforms potential harmful high-frequency oscillations into manageable voltage transitions, reducing EMI while maintaining fast switching performance and low power dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables DC-DC converters to deliver high currents at high switching frequencies with high conversion efficiency, low internal noise, and reduced electromagnetic interference without the need for special bond-free packages.
Implementation Method 1
Incorporating a resistive element between the source terminal of the high-side transistor and the drain terminal of the low-side transistor to dampen voltage oscillations
Data Source
AI summary
A converter configured to convert a DC input voltage to a DC output voltage, may include: a high-side driver circuit having a first terminal coupled to a first die pad; a high-side transistor having a drain terminal coupled to a second die pad and a source terminal coupled to a third die pad; and a low-side transistor having a source terminal coupled to a fourth die pad and a drain terminal coupled to a fifth die pad. The converter may further include a resistive element coupled between the source terminal of the high-side transistor and the drain terminal of the low-side transistor, where a second terminal of the high-side driver circuit is coupled to a sixth die pad.