DC-DC Converter Thermal Conductive Component Overlap
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Solution Overview
Problem
In electric power source devices, the thermal energy discharging capability of connection members is limited when they are required to be thin, leading to a trade-off with their electrical conductive performance, especially in high-power voltage applications where maintaining thermal energy discharge performance is challenging.
Innovation Solution
Incorporating a thermal conductive component arranged in the thickness direction of the circuit substrate to overlap with the magnetic component, allowing thermal energy generated in the magnetic units to be conducted without electrical connection, thereby enhancing thermal energy discharge efficiency while maintaining the thickness and conductive performance of the connection members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of connection members is reduced to meet structural requirements, then electrical conductive performance is improved, but thermal energy discharging capability deteriorates
Solution Approach 1:
The patent divides the thermal management function into separate components: connection members handle electrical conduction while dedicated thermal conductive components (heat sinks, thermal paths) handle heat dissipation. This segmentation allows each component to be optimized independently for its specific function.
Solution Approach 2:
The patent introduces thermal conductive components as intermediary elements between the magnetic units and the external environment. These intermediaries (thermal conductive members, heat dissipation structures) facilitate heat transfer without requiring the connection members to have thick dimensions, thus preserving electrical conductivity while enabling effective thermal management.
2Reliability
If connection members are arranged to face magnetic units for electrical connection, then electrical conductive performance is improved, but thermal energy conducts to other components causing overheating
Solution Approach 1:
The patent extracts the thermal conduction function from the electrical connection path. By separating thermal management into dedicated thermal conductive components, the harmful thermal energy transfer through electrical connections is eliminated, allowing connection members to focus solely on electrical conductivity.
Solution Approach 2:
The patent converts the harmful thermal energy that would otherwise damage components into a manageable thermal flow by directing it through dedicated thermal paths to heat dissipation structures. This transforms the thermal management challenge into a controlled heat transfer process that protects components while maintaining electrical connection integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves thermal energy discharge efficiency, prevents thermal interference, and allows for the miniaturization of the device by maintaining the structural integrity and conductive performance of the connection members, ensuring effective heat dissipation for both magnetic and semiconductor components.
Implementation Method 1
The thermal conductive component is arranged, without electrically connected with the semiconductor component or the circuit substrate, to face a thermal energy discharge surface of the magnetic component to allow thermal energy generated in the magnetic component to be conducted with the thermal conductive component
Data Source
AI summary
A DC-DC converter as an electric power source device has a magnetic component, a semiconductor component, a circuit substrate and a thermal conductive component. The magnetic component has a thermal energy discharge surface. The semiconductor component is electrically connected to the magnetic component. A controller arranged on the circuit substrate is electrically connected to the semiconductor component to control behavior of the semiconductor component. The thermal conductive component is arranged in a thickness direction of the circuit substrate to be overlapped with the magnetic component. The thermal conductive component is arranged, without being electrically connected with the semiconductor component and the circuit substrate, to face the thermal energy discharge surface of the magnetic component to allow thermal energy generated in the magnetic component to be conducted with the thermal conductive component.