DC-DC Converter Thermal Management via Conductive Vias
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Solution Overview
Problem
Current DC-DC converters face challenges in efficiently transferring heat energy from power stage and output inductor components to the printed circuit board (PCB), leading to potential thermal management issues and reduced performance.
Innovation Solution
The implementation of a substrate with electrically conductive vias extending through it from one side to the other, where at least some vias are positioned under the power stage, enhancing heat transfer by connecting the power stage to the backside of the substrate through metal traces, thereby improving thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If power stage components and output inductors are attached to the PCB, then the DC-DC converter can be assembled and function, but significant waste heat accumulates and thermal management becomes problematic
Solution Approach 1:
The patent introduces vertical thermal pathways through the PCB substrate using conductive vias, transitioning from traditional planar heat dissipation to three-dimensional thermal management. The vias extend heat conduction paths from the top surface where power components are mounted, through the substrate, to the bottom surface, enabling heat to be dissipated in the vertical dimension rather than accumulating on the two-dimensional PCB surface.
2Ease of manufacture
If traditional PCB mounting is used, then component assembly is straightforward, but thermal resistance is high and cooling efficiency is reduced
Solution Approach 1:
The conductive vias act as thermal intermediaries, bridging the thermal gap between the power stage components on the top surface and the heat dissipation structures on the bottom surface. These vias provide a dedicated thermal conduction pathway that mediates heat transfer through the PCB substrate, reducing thermal resistance and improving overall heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat energy transfer from the power stage to the substrate, improving thermal management and performance of the DC-DC converter by reducing thermal resistance and enhancing cooling efficiency.
Implementation Method 1
Transfer of this heat energy from each power stage and output inductor to the PCB is a critical design consideration
Data Source
AI summary
A DC-DC converter includes a substrate having opposing first and second sides, a power stage attached to the first side of the substrate and having active semiconductor components operable to provide an output phase of the DC-DC converter, an inductor attached to the first side of the substrate and electrically connected to the power stage through a first metal trace at the first side of the substrate, and a plurality of electrically conductive vias extending through the substrate from the first side to the second side. The vias are electrically connected to the first metal trace. At least some of the vias are disposed at least partly under the power stage. A corresponding method of assembling such a DC-DC converter also is disclosed.