DC Link Capacitor Cooling Structure for Compact Heat Dissipation
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Solution Overview
Problem
DC link capacitors in drive inverters require efficient heat dissipation due to high waste heat generation, which affects their size, weight, and cost.
Innovation Solution
A DC link capacitor design with a cooling structure comprising thermally conductive elements bonded to busbars, arranged in various configurations to enhance thermal conduction and minimize size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If DC link capacitor is designed with conventional structure, then installation space is large, but heat dissipation is insufficient
Solution Approach 1:
The DC link capacitor is divided into multiple capacitor elements arranged in parallel, with thermal conductive elements distributed among them. This segmentation allows heat to be dissipated from multiple locations simultaneously, improving overall heat dissipation efficiency while maintaining a compact structure.
Solution Approach 2:
Thermal conductive elements (such as thermal conductive grease or thermal conductive plates) are introduced as intermediary substances between the capacitor elements and the housing. These intermediaries enhance the thermal coupling between components, enabling more effective heat transfer from the capacitor elements to the housing for dissipation.
2Volume of moving object
If capacitor elements are arranged closer together, then installation space is reduced, but thermal conduction path is lengthened
Solution Approach 1:
The housing is designed with three-dimensional cooling structures, including lateral walls with cooling channels and the bottom wall forming a heat sink. This multi-dimensional thermal conduction approach allows heat to escape in multiple directions (upward through the housing walls and downward through the heat sink), effectively compensating for the increased thermal path length caused by compact capacitor element arrangement.
3Temperature
If cooling structure is added to improve heat dissipation, then heat dissipation is optimized, but device complexity increases
Solution Approach 1:
The housing serves multiple functions: it provides mechanical protection for the capacitor elements, acts as a thermal conduction path for heat dissipation through integrated cooling structures, and functions as a heat sink at the bottom wall. This multi-functionality eliminates the need for separate cooling components, reducing overall device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design optimizes heat dissipation, reducing the size and potentially lowering costs while maintaining performance.
Implementation Method 1
the capacitor elements are each arranged at a distance in a longitudinal direction and at a distance in a transverse direction and are in thermally conductive contact with the cooling structure
Implementation Method 2
the thermal conduction to the cooling surface (usually on the underside, but without limiting the present disclosure thereto) is improved
Data Source
AI summary
A DC link capacitor includes a lower busbar, an upper busbar, a cooling structure, and a plurality of structurally identical capacitor elements which are arranged between the lower busbar and the upper busbar and in electrical contact with the lower busbar and the upper busbar. The capacitor elements are spaced from each other in a longitudinal direction and in a transverse direction and are in thermally conductive contact with the cooling structure. The cooling structure includes thermally conductive element connected in a materially bonded manner to one of the lower busbar and the upper busbar. An active or passive cooling means is connected to an outer surface of one of the lower busbar and the upper busbar.