Power Electronics Cooling Structure for Modules, Capacitors, and DC Links
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Solution Overview
Problem
Existing power electronics systems face inefficiencies in cooling individual components, particularly the power semiconductor module and capacitor device, which can lead to thermal management issues and reduced system performance.
Innovation Solution
A power electronics system design featuring a cooling device with multiple main surfaces, where the power semiconductor module and capacitor device are in thermally conducting contact, and a fluid cooling system with adjustable flow channels and valves to regulate temperature-dependent flow rates, ensuring effective heat dissipation across the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cooling surface is used for both power semiconductor module and capacitor device, then device complexity is reduced, but cooling efficiency of individual components deteriorates
Solution Approach 1:
The cooling device is segmented into multiple independent cooling surfaces (first cooling surface for power semiconductor module, second cooling surface for capacitor device, third cooling surface for connection devices). This segmentation allows each component to be cooled independently with optimized thermal contact, resolving the contradiction between structural simplicity and effective temperature control.
2Temperature
If cooling sections are added to connection devices, then cooling efficiency of individual components is improved, but device complexity increases
Solution Approach 1:
The connection devices serve dual functions: electrical connection and thermal management. By integrating cooling sections directly into the connection devices, the patent combines electrical and thermal functions in a single component, improving cooling efficiency without proportionally increasing overall system complexity.
3Temperature
If DC connection device is thermally connected to cooling device, then cooling efficiency is improved, but electrical insulation requirements increase
Solution Approach 1:
An electrical insulation device is introduced as an intermediary between the DC connection device and the cooling device. This intermediary component enables thermal contact for efficient cooling while maintaining electrical insulation, thus resolving the contradiction between cooling efficiency and electrical safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency by optimizing thermal contact and fluid flow, improving the performance and reliability of power electronics systems by maintaining optimal temperatures across components.
Implementation Method 1
the power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device
Implementation Method 2
a fluid cooling system with adjustable flow channels and valves to regulate temperature-dependent flow rates
Data Source
AI summary
A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device. The cooling device has a first and a second main surface. The power semiconductor module is arranged on the first main surface and is in thermally conducting contact with the cooling device and the capacitor device is arranged on the second main surface and is in thermally conducting contact with the cooling device. At least one DC connection device is connected to a DC module connection of the power semiconductor module and has a first cooling section, which is in thermally conducting contact with the cooling device.