DC Conversion Module Layout for Higher Power Density
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Solution Overview
Problem
Existing power supplies have poor power density due to the bulky design of AC-to-DC converters and DC conversion modules, which are typically implemented on a single motherboard or stacked circuit boards connected by flying wires, leading to increased circuit size and reduced efficiency.
Innovation Solution
A DC conversion module is designed with interleaved or delta-connected circuit boards and transformers, integrated into a main circuit board, utilizing a phase difference in control signals and delta connections to reduce circuit volume and enhance power density, incorporating a power factor corrector and isolated conversion module to optimize space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the AC-to-DC converter and DC conversion module are designed on a single motherboard or stacked circuit boards connected by flying wires, then the power supply can be assembled using conventional methods, but the power density is poor and the circuit size is bulky
Solution Approach 1:
The patent integrates the AC-to-DC converter and DC conversion module onto a single motherboard, merging previously separate circuit boards into one unified structure. This eliminates the need for flying wires and stacked board connections, directly reducing circuit size while maintaining conventional assembly ease
Solution Approach 2:
The patent transitions from a three-dimensional stacked board configuration to a two-dimensional planar integration on a single motherboard. By redistributing circuit components across the motherboard surface and using multi-layer PCB technology, the design achieves high power density without increasing overall footprint
2Adaptability or versatility
If multiple circuit boards are stacked and connected by flying wires, then modular assembly is possible, but the power density cannot be reduced and the power supply becomes bulky
Solution Approach 1:
The patent combines multiple functional modules (AC-to-DC converter, DC conversion module) into a single integrated motherboard design, eliminating the physical separation and flying wire connections of modular stacked boards. This integration directly increases power density by reducing inter-component distances and eliminating connection losses
Solution Approach 2:
The patent extracts and eliminates the flying wires and intermediate connection structures from the modular stacked board design. By removing these unnecessary connection elements and integrating functions directly onto the motherboard, the design achieves higher power density while maintaining assembly flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces circuit volume and increases power density by integrating power components onto a single board, improving heat dissipation and efficiency while meeting high power requirements.
Implementation Method 1
The first transformer includes a first primary-side trace, a first secondary-side trace, and a first iron core. The first primary-side trace is formed on the first circuit board to serve as a first primary-side coil, and the first secondary-side trace is formed on the first circuit board to serve as a first secondary-side coil.
Data Source
AI summary
A power supply unit supplies power to a load, and the power supply unit includes a power factor corrector, a DC conversion module, and an isolated conversion module. The power factor corrector is plugged into a first main circuit board and converts an AC power into a DC power. The DC conversion module is plugged into the first main circuit board and converts the DC power into a main power. The isolated conversion module includes a bus capacitor, the bus capacitor is coupled to the DC conversion module through a first power copper bar, and coupled to the power factor corrector through a second power copper bar. The first power copper bar and the second power copper bar are arranged on a side opposite to the first main circuit board, and are arranged in parallel with the first main circuit board.