In-situ DC Plasma Cleaning for Electrostatic Chuck Pedestal Heater
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Solution Overview
Problem
Current substrate cleaning methods in deposition processes require expensive remote plasma sources, leading to inefficiencies and surface damage, and fail to maintain uniformity and flatness of the substrate support surface due to variations in the gap between the gas distribution plate and the substrate.
Innovation Solution
The use of an electrostatic chuck with interdigitated first and second electrodes, generating plasma between the electrodes to clean the substrate support surface without the need for remote plasma sources, ensuring uniformity and preventing surface damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If remote plasma sources are used for cleaning substrate support surfaces, then cleaning capability is improved, but system cost increases and surface damage occurs
Solution Approach 1:
The patent merges the cleaning function with the existing electrostatic chuck structure by incorporating electrodes directly into the substrate support. This eliminates the need for separate remote plasma sources, reducing system complexity and cost while maintaining effective cleaning capability through in-situ plasma generation at the substrate support surface.
Solution Approach 2:
The electrostatic chuck structure performs dual functions: holding the substrate during processing and cleaning the substrate support surface. By integrating cleaning electrodes into the chuck, the system uses its own existing components to perform maintenance functions, eliminating the need for external cleaning systems and reducing overall system complexity.
2Reliability
If remote plasma sources are used for cleaning, then cleaning effectiveness is improved, but surface corrosion occurs
Solution Approach 1:
The patent introduces a dielectric layer as an intermediary between the plasma generation region and the substrate support surface. This dielectric layer allows plasma to be generated effectively for cleaning while preventing direct contact between reactive plasma species and the metal substrate support, thereby eliminating corrosion while maintaining cleaning effectiveness.
3Manufacturing precision
If substrate support surfaces are cleaned after multiple cycles, then uniformity and flatness are improved, but maintenance time increases
Solution Approach 1:
The patent enables cleaning to be performed immediately after substrate processing by integrating electrodes into the electrostatic chuck. This preliminary action allows the substrate support surface to be cleaned during the same vacuum cycle without requiring chamber breakage or extended maintenance time, thereby maintaining uniformity and flatness without productivity loss.
4Reliability
If gap variations occur between gas distribution plate and substrate, then cleaning efficiency is reduced, but maintaining small uniform gaps is difficult
Solution Approach 1:
The patent implements multiple electrode pairs distributed across different radial positions of the electrostatic chuck, creating localized plasma generation zones. This allows effective cleaning even when gap variations exist between the gas distribution plate and substrate, as each electrode pair can generate plasma independently in its local region, compensating for non-uniform gaps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively cleans the substrate support surface, maintains uniformity and flatness, and reduces costs by eliminating the need for remote plasma sources, while preventing surface damage and corrosion.
Implementation Method 1
A plasma is generated between a first electrode having a first plurality of branches and second electrode having a second plurality of branches
Data Source
AI summary
Substrate supports, substrate support assemblies and methods of using an arc generated between a first electrode and a second electrode to clean a support surface. The first electrode comprises a plurality of first branches which are interdigitated with a plurality of branches of the second electrode in a finger-joint like pattern creating a gap between the first electrode and the second electrode.