DC-Side Terminal Heat Release Structure for Power Path Cooling
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Solution Overview
Problem
The existing electric power conversion apparatuses face issues with heat release capability, leading to potential temperature increases due to heat generation in power distribution paths, such as metal conductors or wires connected to switching elements.
Innovation Solution
Incorporating electrically conductive heat release members on the DC-side terminals of the apparatus, which are connected to semiconductor stacks and bus bars, enhancing heat transfer and preventing local temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat release fins are provided on housing and heat sinks are used on switching elements, then cooling of switching elements is improved, but heat generation in power distribution paths (metal conductors, electric wires) is not addressed leading to temperature increase and potential abnormalities
Solution Approach 1:
The patent merges the electrical connection function and heat dissipation function into a single integrated component (DC-side terminal with heat release member). This eliminates the need for separate cooling measures for power distribution paths while maintaining effective heat transfer from switching elements, thereby addressing both switching element temperature control and power path heat management simultaneously.
Solution Approach 2:
The DC-side terminal is designed to perform multiple functions: electrical connection, current conduction, and heat dissipation. The heat release member integrated onto the terminal serves as both an electrical conductor and a thermal management component, enabling universal functionality that resolves the contradiction between maintaining reliable electrical connections and preventing heat-related abnormalities.
2Temperature
If heat release members are added to DC-side terminals, then heat release capability is improved, but device complexity increases
Solution Approach 1:
The heat release member is merged with the DC-side terminal to form an integrated assembly. This combination eliminates the need for separate mounting of heat dissipation components on power distribution paths, reducing assembly steps and structural complexity while improving heat release capability. The integrated design allows heat transfer from switching elements through the terminal without requiring additional independent cooling structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat release capability, effectively managing heat from semiconductor stacks and preventing temperature rises in the power distribution path, while ensuring voltage balance and increasing device capacity.
Implementation Method 1
The heat release member is electrically conductive... enhancing heat transfer
Data Source
AI summary
An electric power conversion apparatus of an embodiment includes a DC-side terminal and a heat release member. The heat release member is electrically conductive. The heat release member is provided on the DC-side terminal.


