DC-Side Terminal Heat Release Structure for Power Path Cooling

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Solution Overview

Problem

The existing electric power conversion apparatuses face issues with heat release capability, leading to potential temperature increases due to heat generation in power distribution paths, such as metal conductors or wires connected to switching elements.

Innovation Solution

Incorporating electrically conductive heat release members on the DC-side terminals of the apparatus, which are connected to semiconductor stacks and bus bars, enhancing heat transfer and preventing local temperature increases.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If heat release fins are provided on housing and heat sinks are used on switching elements, then cooling of switching elements is improved, but heat generation in power distribution paths (metal conductors, electric wires) is not addressed leading to temperature increase and potential abnormalities

Engineering Contradiction:
Improveswitching element temperatureVSAvoidsystem reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent merges the electrical connection function and heat dissipation function into a single integrated component (DC-side terminal with heat release member). This eliminates the need for separate cooling measures for power distribution paths while maintaining effective heat transfer from switching elements, thereby addressing both switching element temperature control and power path heat management simultaneously.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The DC-side terminal is designed to perform multiple functions: electrical connection, current conduction, and heat dissipation. The heat release member integrated onto the terminal serves as both an electrical conductor and a thermal management component, enabling universal functionality that resolves the contradiction between maintaining reliable electrical connections and preventing heat-related abnormalities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Temperature

If heat release members are added to DC-side terminals, then heat release capability is improved, but device complexity increases

Engineering Contradiction:
Improveheat release capabilityVSAvoidapparatus structure
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat release member is merged with the DC-side terminal to form an integrated assembly. This combination eliminates the need for separate mounting of heat dissipation components on power distribution paths, reducing assembly steps and structural complexity while improving heat release capability. The integrated design allows heat transfer from switching elements through the terminal without requiring additional independent cooling structures.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat release capability, effectively managing heat from semiconductor stacks and preventing temperature rises in the power distribution path, while ensuring voltage balance and increasing device capacity.

Implementation Method 1

The heat release member is electrically conductive... enhancing heat transfer

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230389240A1Electric power conversion apparatus
Publication Date: 2023.11.30 TMEIC CORP
  • US20230389240A1 patent drawing
  • US20230389240A1 patent drawing
  • US20230389240A1 patent drawing

AI summary

An electric power conversion apparatus of an embodiment includes a DC-side terminal and a heat release member. The heat release member is electrically conductive. The heat release member is provided on the DC-side terminal.