DC Terminal Protrusion in Semiconductor Power Module Cooling Jacket
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Solution Overview
Problem
Existing semiconductor power modules for inverter/converters face increased resistance and potential IGBT failure due to lengthy interconnection lengths between DC terminals and condenser modules, leading to increased losses and risk of jump-voltage during current switching.
Innovation Solution
A semiconductor power module design where the DC terminal protrudes beyond the cooling jacket to shorten the interconnection length with the condenser module, combined with a cooling jacket having an opening for the heatsink mounting and integral molding with draft angles for improved cooling efficiency and reduced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the condenser module is provided on a separate surface from the cooling jacket, then the inverter/converter footprint size is minimized, but the interconnection length between DC terminals increases causing increased resistance and losses
Solution Approach 1:
The DC terminal is extended in the vertical dimension (protruding from the cooling jacket surface) rather than relying solely on horizontal proximity. This dimensional change allows the terminal to reach the condenser module more directly, shortening the interconnection path while maintaining a compact horizontal footprint of the overall device.
2Loss of energy
If the interconnection length between DC terminal and condenser module is lengthened, then resistance increases causing increased losses, but shortening it requires more complex assembly
Solution Approach 1:
The DC terminal is integrated as an integral part of the cooling jacket structure rather than being a separate component. This merging of functions (the cooling jacket simultaneously serves as both cooling structure and electrical connection support) simplifies assembly while minimizing interconnection length, as the terminal naturally positions at the optimal location without requiring additional mounting steps.
3Temperature
If the opening on the upper surface of the cooling jacket is covered by the heatsink underside, then direct cooling effect is improved, but the DC terminal positioning becomes more constrained
Solution Approach 1:
The cooling jacket is designed with functional segmentation: the upper surface opening area is covered by the heatsink for thermal management, while the DC terminal is positioned at the periphery or edge of the cooling jacket structure. This segmentation allows the cooling surface and electrical connection points to occupy different spatial zones, enabling both direct cooling effectiveness and accessible terminal positioning without conflict.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces losses and prevents IGBT failure by minimizing interconnection length and enhancing cooling performance, while maintaining a compact footprint and reliable assembly.
Implementation Method 1
heat is transferred to parts being cooled, without thermal grease therebetween
Implementation Method 2
liquid cooling is accomplished usually by bonding fins to a semiconductor power module with, for example, thermal grease therebetween and immersing the fins in a flow passage of cooling water
Implementation Method 3
an interconnection length of a conducting plate for connection between a DC terminal of the semiconductor module and a DC terminal of the condenser module
Data Source
AI summary
In order to achieve reduction in loss, a semiconductor power module comprises DC terminals to be connected to a condenser module and the semiconductor power module is used in combination with a cooling jacket for cooling, and the DC terminals protrude toward the condenser module beyond the cooling jacket.