DCAP Cell Architecture for DRC Compliance and On-Chip Decoupling

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Solution Overview

Problem

The existing use of FILL cells in integrated circuit design leads to waste of valuable chip real estate and is not entirely satisfactory, as they lack functionality and are used to connect power and ground rails as well as solve design rule violations.

Innovation Solution

The introduction of decoupling capacitor (DCAP) cells, which are process-friendly and can be formed using M0 and M1 metal layers or PMOS transistors, to solve design rule checking violations and provide decoupling capacitance, thereby reducing noise and maintaining stable voltage levels without requiring additional M0 and M1 layer resources.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If FILL cells are used to connect power and ground rails and solve design rule violations, then design rule violations are resolved, but valuable chip real estate is wasted due to the lack of functionality in FILL cells

Engineering Contradiction:
Improvedesign rule complianceVSAvoidchip real estate
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The patent applies multi-functionality by designing FILL cells that simultaneously serve two purposes: (1) maintaining design rule compliance by connecting power and ground rails, and (2) providing decoupling capacitance to reduce noise and stabilize voltage. This transforms previously non-functional FILL cells into multi-functional elements that contribute to both structural compliance and electrical performance, thereby eliminating the waste of chip real estate while resolving design rule violations

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If additional decoupling capacitance is provided to reduce noise and maintain stable voltage levels, then power supply stability is improved, but additional M0 and M1 layer resources are required

Engineering Contradiction:
Improvepower supply stabilityVSAvoidM0 and M1 layer resources
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates decoupling capacitance functionality directly into the FILL cells, which are already present in the layout for design rule compliance. By incorporating capacitive elements (such as metal plates connected to power and ground rails) within the existing FILL cell structure, the solution provides additional decoupling capacitance without requiring separate dedicated capacitor structures or additional M0 and M1 layer resources beyond what is already allocated for the FILL cells

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the decoupling capacitance function with the FILL cell structure by combining two previously separate functions (design rule compliance and noise reduction) into a single integrated element. The FILL cell now contains both the structural elements needed for design rule compliance and the capacitive elements needed for power supply stabilization, eliminating the need for separate implementations

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The DCAP cells effectively address design rule checking violations and provide decoupling capacitance, reducing noise and maintaining stable voltage levels while conserving M0 and M1 layer resources, thus optimizing chip layout and functionality.

Implementation Method 1

the one or more DCAP cells comprise at least one capacitor formed by an M0 metal layer and an M1 metal layer

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS20230394217A1Integrated circuit (IC) design methods using process friendly cell architectures
Publication Date: 2023.12.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20230394217A1 patent drawing
  • US20230394217A1 patent drawing
  • US20230394217A1 patent drawing

AI summary

Methods and Apparatuses for making an integrated circuit (IC) are disclosed. In accordance with some embodiments, a method including forming one or more decoupling capacitor (DCAP) cells comprising one or more polysilicon (PO) layers openings formed based on one or more photoresist layer openings formed to solve one or more design rule check (DRC) violations. The one or more DCAP cells also provide decoupling capacitors for the IC.