DCB Substrate Luminescence Device Height Reduction

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional luminescence devices using LEDs face challenges in reducing height and light emitting area while maintaining luminance, due to separate electrode patterns and heat sink layers, which also lead to light diffusion and potential discoloration of emitted light.

Innovation Solution

The luminescence device employs a direct copper bonding (DCB) substrate with integrated electrode patterns and a phosphor layer on the LED chip, along with a reflection preventing glass to minimize light diffusion and height, using a substrate with a first and second copper layer for thermal conductivity and Au for low reflectance, and an encapsulation layer with phosphor to enhance luminance and reduce light emitting area.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If separate electrode patterns and heat sink layers are used, then thermal conductivity is improved, but height and light emitting area increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidheight

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The patent merges the electrode pattern and heat sink layer into a single integrated DCB substrate structure. The DCB substrate simultaneously serves as the electrode carrier and heat dissipation path, eliminating the need for separate components. This integration reduces the overall height while maintaining effective thermal conductivity through the copper layers and substrate material.

Inventive Principle:

Principle #5Merging (Combining)

2Temperature

If separate electrode patterns and heat sink layers are used, then thermal conductivity is improved, but light emitting area increases

Engineering Contradiction:

Improvethermal conductivityVSAvoidlight emitting area

Core Design Contradiction:

TemperatureVSArea of stationary object

Solution Approach 1:

The DCB substrate integrates the electrode pattern directly into the substrate structure, eliminating the need for separate electrode layers. This merging reduces the overall light emitting area while the copper layers within the DCB substrate maintain effective thermal conductivity for heat dissipation from the LED chip.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If conventional substrate structure is used, then manufacturing is simplified, but light diffusion and discoloration occur

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidlight diffusion

Core Design Contradiction:

Ease of manufactureVSIllumination intensity

Solution Approach 1:

The patent employs a composite DCB substrate structure combining ceramic or glass-ceramic material with copper layers. This composite material provides both mechanical support and optimized optical properties, reducing light diffusion and discoloration while maintaining manufacturability through established DCB fabrication processes.

Inventive Principle:

Principle #40Composite materials

4Ease of manufacture

If conventional substrate structure is used, then manufacturing is simplified, but luminance is reduced

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidluminance

Core Design Contradiction:

Ease of manufactureVSIllumination intensity

Solution Approach 1:

The DCB substrate uses composite materials with optimized optical properties that enhance light extraction and reduce internal reflection. The specific composition and structure of the ceramic/glass-ceramic matrix with copper layers improve luminance by minimizing light loss while maintaining compatibility with standard manufacturing processes.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the height and light emitting area of the luminescence device, improves luminance, suppresses light diffusion, and inhibits luminous flux degradation by using Au as the metal layer, resulting in enhanced geometrical efficiency and reduced light discoloration.

Implementation Method 1

a substrate with a first and second copper layer for thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

using a substrate with a first and second copper layer for thermal conductivity and Au for low reflectance

Methodology Applied

Scientific EffectReflection prevention: Anti-Reflective Coating

Implementation Method 3

LED chips which are disposed on the substrate and include a phosphor disposed thereon

Methodology Applied

Scientific EffectPhosphorescence: Phosphorescence

Data Source

PatentUS9093626B2Luminescence device

Publication Date: 2015.07.28 SUZHOU LEKIN SEMICON CO LTD

AI summary

A luminescence device used in a backlight unit for lighting or displaying may include: a substrate including at least two electrode patterns and LED chips which are provided over the substrate and include a phosphor provided thereon. A dam is provided over the substrate, and an encapsulation layer is provided over the substrate. The dam is spaced from the LED Chips, and the substrate comprises a direct copper bonding (DCB) substrate including a first copper layer, a second copper layer and a substrate body.