DC/DC Converter Case Layout for Accurate Temperature Sensing
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Solution Overview
Problem
The accuracy of temperature measurement in electronic devices using surface-mounted temperature sensors is compromised by the substrate and ambient temperatures, affecting the correlation between the case and cooling medium temperatures.
Innovation Solution
An electronic device design featuring a case with a boss and coupling portion that supports a substrate with a land pattern in contact with the case, positioning the temperature sensor to face a recessed surface lower than the substrate support, enhancing heat transfer and reducing ambient temperature interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a temperature sensor is mounted on the surface of a substrate, then the temperature measurement is easier to implement, but the measurement accuracy decreases due to substrate temperature and ambient atmosphere interference
Solution Approach 1:
A thermal conduction member (land pattern) is introduced as an intermediary between the case and the temperature sensor. This land pattern is in direct contact with the case and thermally couples the case temperature to the temperature sensor mounted on the substrate, allowing accurate case temperature measurement while maintaining the ease of substrate mounting.
2Measurement precision
If the temperature sensor is positioned closer to the case to improve measurement accuracy, then the measurement precision improves, but the sensor becomes more susceptible to interference from internal heat sources and substrate temperature
Solution Approach 1:
The temperature sensor is extracted from direct proximity to the case and mounted on the substrate instead. The thermal conduction member (land pattern) extends from the case to the sensor location, allowing the sensor to be positioned away from harmful heat sources while still accurately measuring case temperature through the extended land pattern.
3Measurement precision
If a land pattern is extended to the vicinity of the temperature sensor to improve heat transfer, then the temperature measurement accuracy improves, but the device complexity increases
Solution Approach 1:
The land pattern is merged with the existing substrate structure, combining the electrical circuit board function with the thermal conduction function. The land pattern is formed as an integral part of the substrate using standard PCB manufacturing techniques, eliminating the need for separate thermal conduction components and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the accuracy of case temperature measurement by ensuring the temperature sensor closely reflects the case temperature, accommodating various sensor sizes, and minimizing interference from the substrate and internal heat sources.
Implementation Method 1
a land pattern on a substrate on which a temperature sensor is mounted. The heat from the case is transferred to the land pattern.
Implementation Method 2
a case, a heating element accommodated in the case is cooled by cooling the case using a cooling medium
Data Source
AI summary
A DC/DC converter includes a metal case, a power converter accommodated in the case, a substrate, and a temperature sensor mounted on a surface of the substrate. The case includes a bottom wall, a side wall extending from the bottom wall, a boss, and a coupling portion. The coupling portion couples the side wall to the boss. The coupling portion extends from the bottom wall along an axis of the boss and along a surface of the side wall. The temperature sensor is arranged to face the coupling portion.