DDR Memory Module Assembly Thermal Vibration Resilience
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Solution Overview
Problem
DDR memory packages and DIMMs are not designed to withstand high temperature and vibratory environments, which reduces their service life in aerospace applications.
Innovation Solution
An electronic module assembly with a memory module, a mounting plate, and an electronic module, featuring a printed circuit board with memory packages made of materials with similar thermal expansion coefficients, and aerospace-grade connectors to enhance durability and connectivity, along with copper backing and thermal heat sinks for improved performance in harsh environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If DDR memory packages and DIMMs are used in aerospace applications, then memory functionality is achieved, but service life is reduced due to high temperature and vibration environments
Solution Approach 1:
The patent applies beforehand cushioning by incorporating vibration isolation elements and thermal management components into the memory module assembly before exposure to harsh aerospace environments. The vibration isolation elements are pre-installed between the memory module and mounting structure to cushion against vibratory stresses, while thermal interface materials are pre-applied to manage heat generation, thereby protecting the memory components from thermal and vibration damage during operation.
2Ease of manufacture
If materials with different thermal expansion coefficients are used, then manufacturing ease is improved, but thermal expansion issues arise in high-temperature environments
Solution Approach 1:
The patent applies parameter changes by carefully selecting materials with matched thermal expansion coefficients for the printed circuit board, memory packages, and mounting structure. This parameter matching ensures that all components expand and contract at similar rates during thermal cycling, preventing stress concentration, solder joint failure, and structural delamination that would otherwise occur with dissimilar materials in high-temperature aerospace environments.
3Device complexity
If standard DDR memory modules are used, then device complexity is reduced, but durability in aerospace environments is insufficient
Solution Approach 1:
The patent applies composite materials by constructing the memory module assembly with multiple specialized materials optimized for aerospace environments. This includes using high-temperature conformal coatings on the printed circuit board, vibration-resistant solder joints, thermally conductive interface materials, and mechanically robust connectors. The composite structure integrates these specialized materials to create a memory module that maintains electrical functionality while withstanding thermal cycling, vibration, and shock loads.
Solution Approach 2:
The patent applies segmentation by dividing the memory module into distinct functional components with specialized protection: the printed circuit board is segmented from the mounting structure with vibration isolation elements, thermal management components are segmented as separate heat sinks and thermal interface materials, and connectors are segmented with enhanced mechanical coupling. This segmentation allows each component to be optimized for its specific function while collectively providing aerospace-grade durability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the service life and performance of DDR memory modules by reducing thermal expansion issues and enhancing structural integrity and connectivity, enabling them to operate effectively in high-temperature and vibratory aerospace environments.
Implementation Method 1
the first board is made of a first material and the plurality of memory packages are made of a second material. the first material and the second material have substantially similar coefficients of thermal expansion
Data Source
AI summary
An electronic module assembly has a memory module that includes a memory module and an electronic module. The memory module includes a first board having a first board first surface disposed opposite a first board second surface. The electronic module is operatively connected to the memory module. The electronic module includes a mounting plate having a mounting plate first surface that is disposed opposite a mounting plate second surface that faces towards the first board first surface. The mounting plate has a first post and a second post spaced apart from the first post.