DDR5 Memory Module Temperature Polling for Faster Thermal Control

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The increased number of temperature sensors on DDR5 memory modules in Information Handling Systems (IHSs) leads to delays and inefficiencies in thermal control algorithms, affecting performance and power consumption, and existing fail-over mechanisms result in unnecessary high fan speeds when sensor failures occur.

Innovation Solution

A method for optimizing temperature sensor reading by prioritizing sensor readings on DDR5 memory modules, such as reading middle sensors first, followed by end sensors, and incorporating these readings into a thermal control algorithm, with fail-over strategies using neighboring sensors to maintain efficient cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple temperature sensors are read sequentially on each memory module, then thermal monitoring coverage is improved, but thermal control delays increase

Engineering Contradiction:
Improvethermal monitoring coverageVSAvoidthermal control delays
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent segments the temperature sensor reading process by dividing sensors into different priority groups (first priority, second priority, third priority) based on their thermal importance. This allows the system to read critical sensors more frequently while still monitoring less critical sensors, thereby maintaining comprehensive thermal coverage without uniformly increasing reading frequency across all sensors, thus reducing overall thermal control delays.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements periodic action by establishing different reading intervals for different priority sensors. High-priority sensors are read more frequently than low-priority sensors, creating a periodic monitoring pattern that optimizes thermal control responsiveness for critical areas while reducing the burden of monitoring less critical areas, thereby balancing monitoring coverage with time efficiency.

Inventive Principle:
Principle #19Periodic action

2Measurement precision

If all temperature sensors are read at every thermal control iteration, then thermal control accuracy is improved, but power consumption increases

Engineering Contradiction:
Improvethermal control accuracyVSAvoidpower consumption
Core Design Contradiction:
Measurement precisionVSUse of energy by moving object

Solution Approach 1:

The patent segments temperature sensors into priority levels and applies different reading strategies to each segment. Only high-priority sensors are read at every thermal control iteration, while lower-priority sensors are read less frequently. This segmentation maintains thermal control accuracy for critical areas while significantly reducing the total number of sensor readings performed, thereby lowering power consumption.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies partial action by reading only the necessary subset of sensors (high-priority ones) at every iteration rather than all sensors. This partial monitoring approach provides sufficient thermal control accuracy for decision-making while avoiding the excessive power consumption that would result from reading every sensor at every iteration.

Inventive Principle:
Principle #16Partial or excessive action

3Reliability

If a single temperature sensor fails, then sensor redundancy is reduced, but existing fail-over mechanisms cause unnecessary high fan speeds

Engineering Contradiction:
Improvesensor redundancyVSAvoidunnecessary fan power consumption
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent segments temperature sensors into priority groups and uses this segmentation to intelligently determine fail-over behavior. When a high-priority sensor fails, the system transitions to using lower-priority sensors for thermal control. This segmented approach allows the system to maintain reliable thermal monitoring while avoiding unnecessary high fan speeds that would occur with traditional fail-over mechanisms, as the system can continue operating with reduced but still effective monitoring coverage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements dynamic sensor priority assignment where sensor priorities can change based on operational conditions and failure states. When sensors fail, the system dynamically reconfigures which sensors are considered high-priority, allowing flexible adaptation to sensor failures without triggering unnecessary high fan speeds, thus maintaining both reliability and energy efficiency.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12359981B2Systems and methods for effective reading of multiple temperature sensors on memory modules
Publication Date: 2025.07.15 DELL PROD LP
  • US12359981B2 patent drawing
  • US12359981B2 patent drawing
  • US12359981B2 patent drawing

AI summary

Effectively reading multiple temperature sensors on memory modules may include reading a first of a plurality of temperature sensors on each memory module of a plurality of memory modules, reading a second of the plurality of temperature sensors on each memory module, after reading the first sensors on each memory module, and, if present, reading a third of the plurality of temperature sensors on each memory module of the plurality of memory modules, after reading the second of the sensors on each memory module. The first temperature sensors may be reread prior to reading the third temperature sensors, particularly where the first temperature sensors are middle temperature sensors on each memory module. Upon failing to read a particular temperature sensor, neighboring temperature sensors of the particular temperature sensor may be polled, such as (an) other temperature sensor(s) on the same memory module and/or (a) temperature sensor(s) on adjacent memory module(s).