De-bonding Layer Adhesion Control for Flexible Substrate Separation
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Solution Overview
Problem
The challenge in manufacturing flexible electronic devices is efficiently separating the flexible substrate from a rigid carrier after fabrication, and ensuring the flexible substrate has a protective hard coating layer to extend its lifespan.
Innovation Solution
A substrate structure is developed with a de-bonding layer composed of an acrylate monomer and acrylate-based oligomer, which has a higher adhesion force with the flexible substrate than with the carrier, allowing for easy separation and providing a hard coating for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flexible substrate is fabricated on a rigid carrier using sheet-to-sheet process, then the electronic device can be manufactured, but the flexible substrate cannot be efficiently separated from the carrier after fabrication
Solution Approach 1:
A de-bonding layer is introduced as an intermediary between the flexible substrate and the rigid carrier. This layer has controlled adhesion properties that allow the flexible substrate to be strongly attached during fabrication, then easily separated after fabrication by breaking the adhesion at the de-bonding layer interface.
Solution Approach 2:
The bonding interface is segmented into two distinct adhesion interfaces: one between the de-bonding layer and the carrier, and another between the de-bonding layer and the flexible substrate. This segmentation allows independent optimization of adhesion strength at each interface for different process stages.
2Reliability
If the flexible substrate is used in actual application, then the device can function, but the flexible substrate lacks protective coating and has reduced lifetime
Solution Approach 1:
The de-bonding layer is designed to serve multiple functions: it acts as a release layer during fabrication, provides adhesion during manufacturing, and serves as a protective hard coating layer in the final product. This multi-functionality eliminates the need for separate protective coating layers.
Solution Approach 2:
The protective coating function is merged with the de-bonding layer. The same layer that enables easy separation during manufacturing also provides the hard protective coating needed for the flexible substrate's operational lifetime, combining two previously separate functions into one layer.
3Reliability
If a hard coating layer is formed on the flexible substrate to protect it, then the lifetime is extended, but the manufacturing process becomes more complex
Solution Approach 1:
The protective coating is formed preliminarily as the de-bonding layer during the fabrication process itself, before the flexible substrate is separated from the carrier. This preliminary formation of the protective layer eliminates the need for subsequent coating steps after separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The de-bonding layer effectively isolates from the carrier during separation, serving as a hard coating to prevent scratches and enhance the flexible substrate's impact and abrasion resistance, simplifying the manufacturing process and reducing the need for additional protective layers.
Implementation Method 1
there is a first adhesion force between the de-bonding layer and the carrier, there is a second adhesion force between the de-bonding layer and the flexible substrate, and the second adhesion force is greater than the first adhesion force
Implementation Method 2
The de-bonding layer is prepared from a composition, and the composition includes: at least one acrylate monomer; and at least one acrylate-based oligomer
Data Source
AI summary
According to embodiments of the disclosure, a substrate structure, a method for manufacturing the substrate structure, and a method for manufacturing an electronic device are disclosed. The substrate structure includes a carrier, a de-bonding layer, and a flexible substrate. The carrier has a top surface. The de-bonding layer contacts the carrier, wherein there is a first adhesion force between the de-bonding layer and the carrier. The de-bonding layer is prepared from a composition, and the composition includes at least one acrylate-based monomer and at least one acrylate-based oligomer, wherein the total number of acrylate groups in the acrylate-based monomer and the acrylate-based oligomer is greater than or equal to 3. The flexible substrate covers and contacts the de-bonding layer, wherein there is a second adhesion force between the de-bonding layer and the flexible substrate. The second adhesion force is greater than the first adhesion force.