Electrochemically Debondable Adhesive Tape for Reusable Bonding
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Solution Overview
Problem
Existing adhesive compositions are difficult to debond from substrates without damaging them, and once debonded, they cannot be reused effectively in forming composite structures.
Innovation Solution
A curable and electrochemically debondable adhesive tape comprising an adhesive composition with epoxide compounds, curing agents, healing agents, tougheners, and electrolytes, allowing debonding through an applied electrical potential and subsequent re-use by thermal treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive compositions are designed to maintain strong adhesion during drop or impact events and across wide temperature ranges, then bonding strength and reliability are improved, but the ability to debond without damaging substrates deteriorates
Solution Approach 1:
The patent applies parameter changes by incorporating an electrolyte into the adhesive composition that enables electrochemical debonding. When voltage is applied, the electrolyte facilitates ionic conduction that disrupts the adhesive bond through electrochemical reactions at the substrate interface, allowing controlled debonding without mechanical damage while maintaining strong bonding under normal conditions
Solution Approach 2:
The patent replaces mechanical debonding methods (such as sand blasting or wire brushing) with an electrochemical system. Instead of applying mechanical force to break the bond, an electrical potential is applied to trigger electrochemical reactions that weaken and break the adhesive bonds, enabling damage-free separation of bonded components
2Strength
If adhesive bonds are cured in situ to bond substrates together, then bonding strength is improved, but reusability of the adhesive deteriorates
Solution Approach 1:
The patent applies parameter changes by incorporating an electrolyte into the adhesive composition that enables electrochemical debonding. When voltage is applied, the electrolyte facilitates ionic conduction that disrupts the adhesive bond through electrochemical reactions at the substrate interface, allowing controlled debonding without mechanical damage while maintaining strong bonding under normal conditions
Solution Approach 2:
The patent enables recovery and reuse of the adhesive by allowing clean debonding through electrochemical means. The adhesive can be removed from substrates without degradation, and the same adhesive material can then be applied to bond new substrates, enabling multiple reuse cycles while maintaining bonding performance
3Ease of manufacture
If mechanical processes are used to remove adhesive, then adhesive removal is achieved, but substrate surface damage occurs
Solution Approach 1:
The patent replaces mechanical debonding methods (such as sand blasting or wire brushing) with an electrochemical system. Instead of applying mechanical force to break the bond, an electrical potential is applied to trigger electrochemical reactions that weaken and break the adhesive bonds, enabling damage-free separation of bonded components
4Ease of manufacture
If aggressive chemicals or high temperature are applied to debond adhesive, then adhesive removal is improved, but substrate surface integrity deteriorates
Solution Approach 1:
The patent replaces aggressive chemical or thermal debonding methods with an electrochemical system. By applying electrical potential to trigger electrochemical reactions in the electrolyte-containing adhesive, bonds are broken without exposing substrates to corrosive chemicals or extreme temperatures, preserving substrate surface integrity
Solution Approach 2:
The electrolyte acts as an intermediary that enables controlled electrochemical debonding. It facilitates ionic conduction and electrochemical reactions at the adhesive-substrate interface, providing a gentle yet effective mechanism to break bonds without requiring aggressive external conditions that would damage substrates
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive tape can be easily debonded and reused, maintaining high humidity stability and lap shear strength, facilitating the formation of composite structures.
Implementation Method 1
the electrolyte provides sufficient ionic conductivity to the composition to enable a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 2
the electrolyte provides sufficient ionic conductivity to said composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 3
a curable and electrochemically debondable adhesive tape comprising an adhesive composition comprising: a) at least one epoxide compound; b) a curing agent
Data Source
AI summary
The present inventions is directed to a curable and electrochemically debondable adhesive tape comprising an adhesive composition comprising: a) at least one epoxide compound; b) a curing agent consisting of one or more compounds which have at least one epoxide reactive group and which do not possess a disulfide functional group; c) a healing agent consisting of one or more compounds which contain at least one disulfide functional group and optionally at least one epoxide reactive group selected from: hydroxyl; thiol; amine; or carboxyl; d) a toughener; and, d) an electrolyte, wherein the composition is characterized by a molar ratio of epoxide-reactive groups to epoxide groups of from 0.6:1 to 1.3:1.