Electrochemically Debondable Electronics Assembly for Component Replacement
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Solution Overview
Problem
Existing electronics assemblies require the entire enclosure to be removed for maintenance, repair, or replacement of electronic components, leading to waste and high costs, particularly in battery assemblies for electric vehicles where individual cell or module-level failures necessitate whole assembly replacement.
Innovation Solution
An electronics assembly using a curable electrochemically debondable adhesive that allows specific electronic components to be removed by applying a voltage, enabling independent inspection, maintenance, and replacement within the assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If structural adhesives are applied to fix electronic components within enclosures, then the relative position and structural support of components are improved, but the ability to extract and replace individual components deteriorates
Solution Approach 1:
The adhesive's chemical composition is modified to include electrochemically active species that enable reversible bonding. By changing the chemical parameters of the adhesive to incorporate redox-active components, the bond strength can be dynamically adjusted through electrochemical reactions, allowing components to be firmly attached during operation but easily released during maintenance.
Solution Approach 2:
The mechanical permanent bond of traditional structural adhesives is replaced with an electrochemically controllable bond. Instead of relying solely on mechanical interlocking and chemical adhesion that cannot be reversed, the system uses electrochemical reactions to control the bonding state, enabling on-demand release of components through voltage application.
2Ease of repair
If the entire enclosed assembly is processed for component replacement, then individual component access is achieved, but waste increases and costs rise
Solution Approach 1:
The ability to extract and replace only the specific defective component rather than the entire assembly is enabled through the electrochemically debondable adhesive. This selective extraction eliminates the need to discard functional components when one component fails, significantly reducing material waste and replacement costs.
Solution Approach 2:
The assembly is designed with selectively debondable components that can be independently accessed and replaced. This segmentation of the assembly into independently serviceable units allows maintenance of individual components without affecting the integrity or functionality of other components, enabling precise repair rather than complete replacement.
3Ease of repair
If electrochemically debondable adhesive is used to bond components, then component removal capability is improved, but adhesive complexity increases
Solution Approach 1:
Electrochemically active species serve as intermediaries between the adhesive and the electrodes. These intermediary components enable the transmission of electrochemical energy to the adhesive matrix, triggering the debonding reaction without requiring direct contact between electrodes and adhesive, thus simplifying the overall system architecture while maintaining functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the removal and replacement of specific electronic components without dismantling the entire assembly, reducing waste and costs associated with battery assemblies in electric vehicles by allowing for modular repairs.
Implementation Method 1
an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall, wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition
Data Source
Figure 1a~1b
Figure 2~3b
Figure 4a~4b
AI summary
The present disclosure is directed to an electronics assembly comprising: a housing having walls which define an enclosure having at least one floored chamber, wherein at least one wall of the housing is provided with an electrically conductive surface which faces into a chamber; n electronic components disposed in the enclosure, wherein n is an integer of at least 2 and wherein at least a fraction of said electronic components are provided with an electrically conductive exterior surface; and, an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall, wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition comprising: a non-polymerizable electrolyte; a rheology control agent; and, a matrix resin.