Electrochemically Debondable Electronics Assembly for Selective Repair
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Solution Overview
Problem
Existing electronic component assemblies require whole assembly replacement due to structural adhesives, leading to waste and high costs, especially in battery assemblies for electric vehicles.
Innovation Solution
An electronics assembly using a curable electrochemically debondable adhesive with a non-polymerizable electrolyte, rheology control agent, and matrix resin, allowing components to be removed by applying voltage, enabling selective disassembly of specific components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If structural adhesives are applied to fix electronic components within enclosures, then the relative position and structural support of components are improved, but the ability to extract and replace specific components is lost
Solution Approach 1:
The adhesive's chemical composition is modified to include electrochemically active components that respond to electrical stimuli. This parameter change allows the adhesive to transition from a permanent structural bond to a reversible bond when voltage is applied, enabling component removal while maintaining structural integrity during normal operation
Solution Approach 2:
The mechanical permanent bonding system is replaced with an electrochemically controllable bonding system. Instead of relying solely on mechanical adhesion strength, the system uses electrical fields to modulate the adhesive properties, allowing dynamic control over component fixation and release
2Ease of repair
If the entire enclosed assembly is processed for component repair, then component access is achieved, but assembly disintegration and replacement waste occur
Solution Approach 1:
The desired component or sub-assembly is selectively extracted from the enclosed assembly using the electrochemically debondable adhesive. This allows repair and replacement of only the necessary components rather than the entire assembly, reducing material waste while maintaining ease of access
Solution Approach 2:
The assembly is designed with selective debondable bonds that allow segmentation into individual replaceable components. This segmentation enables modular repair where only failed components are removed and replaced, preserving functional components and reducing overall assembly waste
3Ease of repair
If electrochemically debondable adhesive is used, then selective component removal is enabled, but adhesive composition complexity increases
Solution Approach 1:
Electrochemically active intermediaries are incorporated into the adhesive formulation to mediate between the electrical stimulus and the bonding mechanism. These intermediaries enable controlled debonding through voltage application while maintaining simple application procedures and structural performance during normal operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates independent removal and replacement of electronic components, reducing waste and costs by allowing selective disassembly without dismantling the entire assembly.
Implementation Method 1
an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall, wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition
Data Source
AI summary
The present disclosure is directed to an electronics assembly comprising:a housing having walls which define an enclosure having at least one floored chamber, wherein at least one wall of the housing is provided with an electrically conductive surface which faces into a chamber;n electronic components disposed in the enclosure, wherein n is an integer of at least 2 and wherein at least a fraction of said electronic components are provided with an electrically conductive exterior surface; and,an adhesive by which said electrically conductive exterior surface of said fraction of electronic components is adhered to said electrically conductive surface of wall,wherein the electronics assembly is characterized in that said adhesive is obtained by curing a curable electrochemically debondable adhesive composition comprising: a non-polymerizable electrolyte; a rheology control agent; and, a matrix resin.